Lens moving apparatus and camera module and optical device including the same

ABSTRACT

Embodiments provide a lens moving apparatus including a bobbin including a first coil disposed on an outer circumferential surface thereof, a housing provided with first and second magnets for moving the bobbin by interaction with the first coil, upper and lower elastic members each coupled to both the bobbin and the housing, and a first position sensor for detecting a sum of intensities of magnetic fields of the first and second magnets, wherein the first position sensor is disposed in a space between the first magnet and the second magnet when the bobbin is disposed at an initial position.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/727,107, filed Dec. 26, 2019; which is a continuation of U.S.application Ser. No. 15/890,919, filed Feb. 7, 2018, now U.S. Pat. No.10,551,587, issued Feb. 4, 2020; which is a continuation of U.S.application Ser. No. 15/144,148, filed May 2, 2016, now U.S. Pat. No.9,921,388, issued Mar. 20, 2018, which claims benefit under 35 U.S.C. §119 of Korean Patent Application Nos. 10-2015-0061040, filed Apr. 30,2015; and 10-2015-0091810, filed Jun. 29, 2015, all of which are herebyincorporated by reference in their entirety.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus and to a camera module andan optical device each including the same.

BACKGROUND

Technology of a voice coil motor (VCM), which is used in existinggeneral camera modules, is difficult to apply to a micro-scale,low-power camera module, and studies related thereto have been activelyconducted.

In the case of a camera module configured to be mounted in a smallelectronic product, such as a smart phone, the camera module mayfrequently receive shocks when in use, and may undergo fine shaking dueto, for example, the shaking of a user's hand. In consideration of thisfact, there is a demand for the development of technology enabling adevice for inhibiting handshake to be additionally installed to a cameramodule.

BRIEF SUMMARY

Embodiments provide a lens moving apparatus and a camera module and anoptical device each including the same, which are able to improve thereliability of operation of auto-focusing by inhibiting an effectthereon attributable to deviation in the intensity of a magnetic fieldof a magnet due to variation in temperature, and which are able toautomatically compensate for variation in the focal length of the lenscaused by variation in temperature.

Furthermore, embodiments provide a lens moving apparatus and a cameramodule and an optical device each including the same, which are able tosuppress the generation of cracks in terminals and to inhibit breakageof the terminals.

In one embodiment, a lens moving apparatus includes a bobbin including afirst coil disposed on an outer circumferential surface thereof, ahousing provided with first and second magnets for moving the bobbin byinteraction with the first coil, upper and lower elastic members eachcoupled to both the bobbin and the housing, and a first position sensorfor detecting a sum of intensities of magnetic fields of the first andsecond magnets, wherein the first position sensor is disposed in a spacebetween the first magnet and the second magnet when the bobbin isdisposed at an initial position.

The first position sensor may be disposed on an outer circumferentialsurface of the bobbin so as to be spaced apart from the first coil suchthat the first position sensor is disposed in the space between thefirst magnet and the second magnet when the bobbin is disposed at theinitial position.

The first magnet may be disposed at an upper end of the housing, and thesecond magnet may be disposed at a lower end of the housing so as to bespaced apart from the first magnet.

The first position sensor may not overlap the first magnet or the secondmagnet in a direction perpendicular to an optical axis when the bobbinis disposed at the initial position.

The first position sensor may include a detecting portion for detectingintensity of a magnetic field, and the detecting portion of the firstposition sensor may be disposed in the space between the first magnetand the second magnet and may not overlap the first magnet or the secondmagnet in a direction perpendicular to an optical axis when the bobbinis disposed at the initial position.

The detecting portion of the first position sensor may be positioned soas to face the outer circumferential surface of the bobbin.

The detecting portion of the first position sensor may detect intensityof a magnetic field in which a line of magnetic force is directed froman inner circumferential surface toward the outer circumferentialsurface of the bobbin.

The detecting portion of the first position sensor may be aligned withan upper surface of the first magnet in the direction perpendicular tothe optical axis when the bobbin is disposed at a first position, andthe first position may be a highest position to which the bobbin ismoved by interaction between the first coil and the first and secondmagnets.

The detecting portion of the first position sensor may be aligned withan imaginary line or plane, which is spaced upward and apart from anupper surface of the first magnet by a first distance, in the directionperpendicular to the optical axis when the bobbin is disposed at a firstposition, and the first position may be a highest position, to which thebobbin is moved by interaction between the first coil and the first andsecond magnets.

The first distance may be 100 μm or less.

The detecting portion of the first position sensor may be aligned withan upper surface of the second magnet in the direction perpendicular tothe optical axis when the bobbin is disposed at a second position, andthe second position may be a lowest position, to which the bobbin ismoved by interaction between the first coil and the first and secondmagnets.

The detecting portion of the first position sensor may be aligned withan imaginary line or plane, which is spaced downward apart from an uppersurface of the second magnet by a second distance, in the directionperpendicular to the optical axis when the bobbin is disposed at asecond position, and the second position may be a lowest position, towhich the bobbin is moved by interaction between the first coil and thefirst and second magnets.

The second distance may be 100 μm or less.

The housing may include a first side portion, a second side portion, afirst magnet seat formed at an upper end of an outer portion of thefirst side portion, the first magnet being disposed in the first magnetseat, and a second magnet seat formed at a lower end of an inner portionof the second side portion, the second magnet being disposed in thesecond magnet seat.

In another embodiment, a lens moving apparatus includes a bobbinincluding a first coil disposed on an outer circumferential surfacethereof, a housing provided with first and second magnets for moving thebobbin by interaction with the first coil, upper and lower elasticmembers each coupled to both the bobbin and the housing, and a firstposition sensor for detecting a sum of intensities of magnetic fields ofthe first and second magnets, wherein a sum of intensities of magneticfields detected by the first position sensor is zero or greater whilethe bobbin moves.

The first position sensor may be disposed in the space between the firstmagnet and the second magnet when the bobbin is disposed at an initialposition.

Intensity of a magnetic field of the first magnet, intensity of amagnetic field of the second magnet, and a sum of intensities ofmagnetic fields of the first and second magnets detected by the firstposition sensor may have positive values when the bobbin is disposed ata first position, and the first position may be a highest position towhich the bobbin is moved by interaction between the first coil and thefirst and second magnets.

Intensity of a magnetic field of the first magnet, intensity of amagnetic field of the second magnet, and a sum of intensities ofmagnetic fields of the first and second magnets detected by the firstposition sensor may have positive values when the bobbin is disposed atan initial position, and the initial position may be a position of thebobbin when no power is applied to the first coil.

In a further embodiment, a camera module includes a lens barrel, thelens moving apparatus according to the first embodiment for moving thelens barrel, and an image sensor for converting an image, introducedthrough the lens moving apparatus, into an electric signal.

In still a further embodiment, an optical apparatus includes a displaymodule including a plurality of pixels, the plurality of pixels beingchanged in color in response to an electric signal, the camera moduleaccording to the third embodiment for converting an image, introducedthrough a lens, into an electric signal, and a controller forcontrolling operation of the display module and the camera module.

BRIEF DESCRIPTION OF THE DRAWINGS

Arrangements and embodiments may be described in detail with referenceto the following drawings in which like reference numerals refer to likeelements and wherein:

FIG. 1 is a perspective view illustrating a lens moving apparatusaccording to an embodiment;

FIG. 2 is an exploded perspective view of the lens moving apparatusillustrated in FIG. 1;

FIG. 3 is an assembled perspective view illustrating the lens movingapparatus shown in FIG. 1, from which a cover member is removed;

FIG. 4 is an exploded perspective view of a bobbin, a first coil, afirst magnet, a second magnet, a first position sensor, and a sensorboard, which are illustrated in FIG. 2;

FIG. 5A is a plan view illustrating the bobbin and the second magnet,which are illustrated in FIG. 4;

FIG. 5B is an exploded perspective view illustrating the sensor boardand the first position sensor, which are illustrated in FIG. 4;

FIG. 5C is a rear perspective view illustrating an embodiment of thesensor board illustrated in FIG. 4;

FIG. 6 is a top perspective view of the housing illustrated in FIG. 1;

FIG. 7 is a bottom exploded perspective view of the housing, the firstmagnet, and the second magnet, which are illustrated in FIG. 2;

FIG. 8 is a sectional view taken along line I-I′ in FIG. 3;

FIG. 9 is a plan perspective view illustrating the coupled state of thebobbin, the housing, the upper elastic member, the first positionsensor, the sensor board, and the plurality of support members, whichare illustrated in FIG. 2;

FIG. 10 is a bottom perspective view illustrating the coupled state ofthe bobbin, the housing, the lower elastic member, and the plurality ofsupport members, which are illustrated in FIG. 2;

FIG. 11 is an assembled perspective view illustrating the upper elasticmember, the lower elastic member, the first position sensor, the sensorboard, the base, the support members, and the circuit board, which areillustrated in FIG. 2;

FIG. 12 is an exploded perspective view illustrating the base, thesecond coil and the circuit board illustrated in FIG. 1;

FIG. 13 is a graph illustrating variation in the intensity of a magneticfield relative to variation in ambient temperature;

FIG. 14 is a graph illustrating the intensity of a magnetic field of thefirst magnet, the intensity of a magnetic field of the second magnet,and the sum of the intensities of magnetic fields of the first andsecond magnets when the movable unit moves;

FIG. 15 is a graph illustrating the range of use in the intensity ofmagnetic field according to an embodiment;

FIG. 16 is a view illustrating the relative positional relationshipsbetween the first position sensor, the first magnet and the secondmagnet at the initial position of the movable unit;

FIG. 17A is a view illustrating the relative positional relationshipsbetween the first position sensor, the first magnet and the secondmagnet at the first position of the movable unit;

FIG. 17B is a view illustrating another embodiment of FIG. 17A;

FIG. 18A is a view illustrating the relative positional relationshipsbetween the first position sensor, the first magnet and the secondmagnet at the second position of the movable unit;

FIG. 18B is a view illustrating another embodiment of FIG. 18A;

FIG. 19 is an exploded perspective view illustrating a camera moduleaccording to an embodiment;

FIG. 20 is an assembled perspective view illustrating a lens movingapparatus according to another embodiment;

FIG. 21 is an exploded perspective view illustrating a camera moduleincluding the lens moving apparatus shown in FIG. 20;

FIG. 22 is a plan view illustrating a printed circuit board according toan embodiment;

FIG. 23 is an enlarged view illustrating portion A in FIG. 22;

FIG. 24 is an enlarged view illustrating a printed circuit boardaccording to another embodiment;

FIG. 25 is an enlarged view illustrating a printed circuit boardaccording to a further embodiment;

FIG. 26 is a side view of the printed circuit board shown in FIG. 25when viewed in the direction of B;

FIG. 27 is an enlarged view illustrating a printed circuit boardaccording to still a further embodiment;

FIG. 28 is a perspective view illustrating a portable terminal includinga camera module according to an embodiment; and

FIG. 29 is a view illustrating the configuration of the portableterminal illustrated in FIG. 28.

DETAILED DESCRIPTION

Hereinafter, embodiments will be clearly revealed via descriptionthereof with reference to the accompanying drawings. In the followingdescription of the embodiments, it will be understood that, when anelement such as a layer (film), region, pattern, or structure isreferred to as being “on” or “under” another element, it can be“directly” on or under another element or can be “indirectly” formedsuch that an intervening element may also be present. In addition, itwill also be understood that the criteria for “on” or “under” aredetermined on the basis of the drawings.

In the drawings, the dimensions of layers are exaggerated, omitted orillustrated schematically for clarity and convenience of description. Inaddition, the dimensions of constituent elements do not entirely reflectthe actual dimensions. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.

Hereinafter, a lens moving apparatus according to an embodiment will bedescribed with reference to the accompanying drawings. For theconvenience of description, although the lens moving apparatus isdescribed using a rectangular coordinate system (x, y, z), the lensmoving apparatus may be described using some other coordinate systems,and the embodiment is not limited thereto. In the respective drawings,the X-axis and the Y-axis mean directions perpendicular to an opticalaxis, i.e. the Z-axis, and the optical axis (Z-axis) direction may bereferred to as a “first direction”, the X-axis direction may be referredto as a “second direction”, and the Y-axis direction may be referred toas a “third direction”.

A “handshake compensation device”, which is applied to a subminiaturecamera module of a mobile device such as, for example, a smart phone ora tablet PC, may be a device that is configured to inhibit the contourline of a captured image from being indistinctly formed due to vibrationcaused by shaking of the user's hand when capturing a still image.

In addition, an “auto-focusing device” is a device that automaticallyfocuses an image of a subject on an image sensor surface. The handshakecompensation device and the auto-focusing device may be configured invarious ways, and the lens moving apparatus according to the embodimentmay move an optical module, which is constituted of at least one lens,in the first direction, which is parallel to the optical axis, orrelative to a plane defined by the second and third directions, whichare perpendicular to the first direction, thereby performing handshakecompensation motion and/or auto-focusing.

FIG. 1 is a schematic perspective view illustrating the lens movingapparatus according to an embodiment, and FIG. 2 is an explodedperspective view of the lens moving apparatus illustrated in FIG. 1.

Referring to FIGS. 1 and 2, the lens moving apparatus may include acover member 300, an upper elastic member 150, a sensor board 180, afirst position sensor 170, a first coil 120, a bobbin 110, a housing140, a first magnet 190, a second magnet 130, a lower elastic member160, a plurality of support members 220, a second coil 230, a circuitboard 250, a second position sensor 240, and a base 210.

First, the cover member 300 will be described.

The cover member 300 defines an accommodation space along with the base210, such that the upper elastic member 150, the bobbin 110, the firstcoil 120, the housing 140, the first magnet 190, the second magnet 130,the lower elastic member 160, the support members 220, the second coil230, and the circuit board 250 are accommodated in the accommodationspace.

The cover member 300 may take the form of a box, which has an openbottom and includes an upper end portion and sidewalls. The bottom ofthe cover member 300 may be coupled to the top of the base 210. Theupper end portion of the cover member 300 may have a polygonal shape,such as, for example, a square or octagonal shape.

The cover member 300 may have a bore formed in the upper end portionthereof in order to expose a lens (not shown), coupled to the bobbin110, to outside light. In addition, the bore of the cover member 300 maybe provided with a window formed of a light-transmitting material, inorder to inhibit impurities, such as, for example, dust or moisture,from entering a camera module.

Although the material of the cover member 300 may be a non-magneticmaterial such as, for example, SUS in order to inhibit the cover member300 from being attracted by the second magnet 130, the cover member 300may be formed of a magnetic material, and may function as a yoke.

FIG. 3 is an assembled perspective view illustrating the lens movingapparatus after removal of the cover member 300 of FIG. 1, and FIG. 4 isan exploded perspective view of the bobbin 110, the first coil 120, thefirst magnet 190, the second magnets 130-1 to 130-4, the first positionsensor 170, and the sensor board 180 illustrated in FIG. 2.

Next, the bobbin 110 will be described.

Referring to FIGS. 3 and 4, the bobbin 110 is placed inside the housing140, and is movable in the direction of the optical axis or in the firstdirection, which is parallel to the optical axis, for example, in theZ-axis direction, via electromagnetic interaction between the first coil120 and the second magnet 130.

Although not illustrated, the bobbin 110 may include a lens barrel (notshown) in which at least one lens is installed. The lens barrel may becoupled inside the bobbin 110 in various manners.

The bobbin 110 may be configured to have a bore for mounting the lens orthe lens barrel. The bore may have a circular, elliptical, or polygonalshape, without being limited thereto.

The bobbin 110 may include first and second protrusions 111 and 112.

The first protrusion 111 of the bobbin 110 may include a guide portion111 a and a first stopper 111 b.

The guide portion 111 a of the bobbin 110 may serve to guide theposition at which the upper elastic member 150 is installed. Forexample, as exemplarily illustrated in FIG. 3, the guide portion 111 aof the bobbin 110 may guide the path along which a first frame connector153 of the upper elastic member 150 extends.

For example, a plurality of guide portions 111 a may protrude in thesecond and third directions, which are perpendicular to the firstdirection. In addition, the guide portions 111 a may be arranged in apattern symmetric with respect to the center of the plane defined by thex-axis and the y-axis, as illustrated in the drawings, or may bearranged in a pattern asymmetric with respect to the center withoutinterference with other components, unlike the embodiment illustrated inthe drawings.

The second protrusion 112 of the bobbin 110 may be formed so as toprotrude in the second and third directions, which are perpendicular tothe first direction. In addition, the second protrusion 112 of thebobbin 110 may have an upper surface 112 a having a shape on which thefirst inner frame 151 is mounted.

The first stopper 111 b of the first protrusion 111 of the bobbin 110and the second protrusion 112 of the bobbin 110 may serve to inhibit thebottom surface of the body of the bobbin 110 from directly collidingwith the base 210 and the upper surface of the circuit board 250 even ifthe bobbin 110 moves beyond a prescribed range due to, for example,external shocks, when being moved in the first direction forauto-focusing.

The bobbin 110 may have a support groove 114 provided between the innercircumferential surface 110 a and the outer circumferential surface 110b of the bobbin 110 so as to allow the sensor board 180 to be insertedinto the bobbin 110 in the first direction. For example, the supportgroove 114 in the bobbin 110 may be provided between the innercircumferential surface 110 a of the bobbin 110 and the first and secondprotrusions 111 and 112 so as to enable the insertion of the sensorboard 180 in the first direction. Furthermore, the support groove 114 ofthe bobbin 110 may be configured to have the shape of a ring definedbetween the inner circumferential surface 110 a and the outercircumferential surface of the bobbin 110.

The bobbin 110 may have a receiving recess 116, in which the firstposition sensor 170, which is disposed, coupled, or mounted on thesensor board 180, is received or disposed.

For example, the receiving recess 116 of the bobbin 110 may be providedin the space between the first and second protrusions 111 and 112 of thebobbin 110, so as to allow the first position sensor 170, mounted on thesensor board 180, to be inserted in the first direction.

The bobbin 110 may have a second support protrusion 117 (see FIG. 8)formed on the lower surface thereof so as to be coupled and fixed to thelower elastic member 160.

For control of auto-focusing in a single direction, the position atwhich the lower surfaces of the first and second protrusions 111 and 112of the bobbin 110 come into contact with the bottom surface 146 a of afirst seating groove 146 in the housing 140 may be set to the initialposition of the bobbin 110. Here, the initial position of the bobbin 110may be equally applied to the description of the initial position of themovable unit, which will be set forth later.

In contrast, for control of auto-focusing in two directions, theposition at which the lower surfaces of the first and second protrusions111 and 112 of the bobbin 110 are spaced apart from the bottom surface146 a of the first seating groove 146 by a predetermined distance may beset to the initial position of the bobbin 110.

Next, the first coil 120 will be described.

The first coil 120 is disposed on the outer circumferential surface 110b of the bobbin 110.

The first coil 120 may be located so as not to overlap the firstposition sensor 170 in the second or third direction.

In order to ensure that the first coil 120 and the first position sensor170 do not interfere or overlap each other in the second or thirddirection, the first coil 120 and the first position sensor 170 may belocated on the outer circumferential surface of the bobbin 110 so as tobe spaced apart from each other. For example, the first coil 120 may belocated on the lower side or the lower portion of the outercircumferential surface 110 b of the bobbin 110, and the first positionsensor 170 may be located on the upper side of the first coil 120.

The first coil 120, as exemplarily illustrated in FIG. 4, may be woundso as to surround the outer circumferential surface 110 b of the bobbin110 in the direction in which the first coil 120 rotates about theoptical axis. For example, the first coil 120 may be inserted into andcoupled to a coil groove formed in the outer circumferential surface 110b of the bobbin 110, without being limited thereto.

As exemplarily illustrated in FIG. 4, the first coil 120 may be directlywound around the outer circumferential surface 110 b of the bobbin 110.

As exemplarily illustrated in FIG. 8, the first coil 120 may be fitted,disposed or secured in a groove 118 formed in the outer circumferentialsurface 110 b of the bobbin 110.

In FIG. 4, although the first coil 120 may be situated directly on theouter circumferential surface 110 b of the bobbin 110, the disclosure isnot limited thereto. In another example, the first coil 120 may be woundaround the bobbin 110 via a coil ring, or may be configured to have theform of an angled ring-shaped coil block. In this case, the coil ringmay be coupled to the bobbin 110 in the same manner as the manner inwhich the sensor board 180 is fitted into the support groove 114 in thebobbin 110.

As illustrated in FIG. 2, the first coil 120 may be configured to havean octagonal shape. The reason for this is because the shape of thefirst coil 120 is configured to correspond to the shape of the outercircumferential surface 110 b of the bobbin 110, which is octagonal, asillustrated in FIG. 5A.

At least four sides of the first coil 120 may be configured to have alinear shape, and the corner portions between the four sides may also beconfigured to have a linear shape. However, they may also be configuredto have a round shape.

The first coil 120 may produce electromagnetic force via electromagneticinteraction between the first coil 120 and the magnet 130 when currentis supplied thereto, thereby moving the bobbin 110 in the firstdirection using the electromagnetic force.

The first coil 120 may be configured to correspond to the second magnet130. When the second magnet 130 is constituted by a single body suchthat the surface of the second magnet 130 that faces the first coil 120has the same polarity, the surface of the first coil 120 that faces thesecond magnet 130 may also be configured to have the same polarity.

If the second magnet 130 is divided into two or four segments by aplane, which is perpendicular to the optical axis, such that the surfaceof the magnet 130 that faces the first coil 120 is correspondinglysectioned into two or more surfaces, the first coil 120 may also bedivided into a number of coil segments that corresponds to the number ofsecond magnet segments.

Next, the first position sensor 170 and the sensor board 180 will bedescribed.

The first position sensor 170 may be disposed, coupled, or mounted onthe bobbin 110 so as to move along with the bobbin 110.

The first position sensor 170 may move along with the bobbin 110 whenthe bobbin 110 moves in the first direction. The first position sensor170 may detect the sum of the strength of the magnetic field of thefirst magnet 190 and the strength of the magnetic field of the secondmagnet 130 depending on the movement of the bobbin 110, and may form anoutput signal based on the detected result. The displacement in theoptical axis direction of the bobbin 110 or the first direction may becontrolled using the output signal from the first position sensor 170.

The first position sensor 170 may be conductively connected to thesensor board 180. The first position sensor 170 may take the form of adriver that includes a Hall sensor, or may take the form of a positiondetection sensor alone such as, for example, a Hall sensor.

The first position sensor 170 may be disposed, coupled, or mounted onthe bobbin 110 in various forms, and may receive current in various waysdepending on the manner in which the first position sensor 170 isdisposed, coupled, or mounted.

The first position sensor 170 may be disposed, coupled, or mounted onthe outer circumferential surface 110 b of the bobbin 110.

For example, the first position sensor 170 may be disposed, coupled, ormounted on the sensor board 180, and the sensor board 180 may bedisposed or coupled to the outer circumference surface 110 b of thebobbin 110. In other words, the first position sensor 170 may beindirectly disposed, coupled or mounted on the bobbin 110 via the sensorboard 180.

The first position sensor 170 may be conductively connected to at leastone of the upper elastic member 150 and the lower elastic member 160.For example, the first position sensor 170 may be conductively connectedto the upper elastic member 150.

FIG. 5A is a plan view illustrating the bobbin 110 and the second magnet130 (130-1, 130-2, 130-3 and 130-4), which are illustrated in FIG. 4.FIG. 5B is an exploded perspective view illustrating the sensor board180 and the first position sensor 170, which are illustrated in FIG. 4.FIG. 5C is a rear perspective view illustrating the sensor board 180according to an embodiment, which is illustrated in FIG. 4.

Referring to FIGS. 4 and 5A, the sensor board 180 may be mounted on thebobbin 110, and may move along with the bobbin 110 in the optical axisdirection.

For example, the sensor board 180 may be coupled to the bobbin 110 bybeing fitted or disposed in the support groove 114 in the bobbin 110.The sensor board 180 is sufficient so long as it is mounted on thebobbin 110. Although FIG. 4 illustrates a sensor board 180 having a ringshape, the disclosure is not limited thereto.

The first position sensor 170 may be attached to and supported by thefront surface of the sensor board 180 using an adhesive member such as,for example, epoxy or a piece of double-sided tape.

The outer circumferential surface 110 b of the bobbin 110 may includefirst side surfaces S1 and second side surfaces S2. The first sidesurfaces S1 correspond to first side portions 141 of the housing 140 onwhich the second magnet 130 is disposed. The second side surfaces S2 arelocated between the first side surfaces S1 so as to connect the firstside surfaces S1 to one another.

The first position sensor 170 may be disposed on any one of the firstside surfaces S1 of the bobbin 110. For example, the recess 116 in thebobbin 110 may be provided in either one of the first side surfaces S1of the bobbin 110, and the first position sensor 170 may be located inthe recess 116 in the bobbin 110.

Referring to FIG. 5A, the first position sensor 170 may be disposed,coupled, or mounted to an upper portion, a middle portion, or a lowerportion of the outer circumferential surface of the sensor board 180 invarious forms.

For example, the first position sensor 170 may be disposed on any one ofthe upper portion, the middle portion and the lower portion of the outercircumferential surface of the sensor board 180 so as to be disposed ordirected in the first direction in the space between the first andsecond magnets 190 and 130 at the initial position of the bobbin 110.The first position sensor 170 may receive current from outside through acircuit of the sensor board 180.

The first position sensor 170 may be disposed, coupled or mounted on theupper portion of the outer circumferential surface of the sensor board180 so as to be positioned or arranged in the space between the firstand second magnets 190 and 130 in the first direction from the initialposition of the bobbin 110.

The first position sensor 170 may be disposed on the upper portion ofthe outer circumferential surface of the sensor board 180 so as to bepositioned as far from the first coil 120 as possible such that thefirst position sensor 170 is not influenced by the magnetic fieldgenerated by the first coil 120, thereby inhibiting malfunctions orerrors of the first position sensor 170.

As illustrated in FIG. 5B, for example, the sensor board 180 may have amounting recess 183 formed in the upper portion of the outercircumferential surface thereof, and the first position sensor 170 maybe disposed, coupled or mounted in the mounting recess 183 in the sensorboard 180.

In order to allow more efficient injection of epoxy or the like forassembly of the first position sensor 170, at least one surface of themounting recess 183 of the sensor board 180 may be provided with aninclined surface (not shown). Although additional epoxy or the like maynot be injected into the mounting recess 183 in the sensor board 180, itmay be possible to increase the force with which the first positionsensor 170 is disposed, coupled or mounted by injecting epoxy or thelike into the mounting recess 183.

The sensor board 180 may include a body 182, elastic member contactportions 184-1 to 184-4, and a circuit pattern Ll-L4.

When the support groove 114 in the bobbin 110 has the same shape as thatof the outer circumferential surface of the bobbin 1100, the body 182 ofthe sensor board 180, which is fitted into the support groove 114 of thebobbin 110, may have a shape which is capable of being fitted into thegroove 114 and being secured thereto.

Although the support groove 114 in the bobbin 110 and the body 182 ofthe sensor board 180 may have a circular shape when viewed in a planview, as illustrated in FIGS. 3 to 5A, the disclosure is not limitedthereto. In another embodiment, the support groove 114 in the bobbin 110and the body 182 of the sensor board 180 may have a polygonal shape whenviewed in a plan view.

Referring to FIG. 5B, the body 182 of the sensor board 180 may include afirst segment 182 a, on which the first position sensor 170 is disposed,coupled, or mounted, and a second segment 182 b, which extends from thefirst segment 182 a and which is fitted into the support groove 114 inthe bobbin 110.

Although the sensor board 180 may have an opening 181 in the portionthereof that faces the first segment 182 a so as to be easily fittedinto the support groove 114 in the bobbin 110, the disclosure is notlimited to any specific structure of the sensor board 180.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may protrude from the body 182 of the sensor board 180 in, forexample, the optical axis direction or the first direction in which thecontact portions can come into contact with the first inner frame 151.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may be connected to the first inner frame 151 of the upper elasticmember 150.

The circuit pattern Ll-L4 of the sensor board 180 may be formed on thebody 182 of the sensor board 180, and may conductively connect the firstposition sensor 170 and the elastic member contact portions 184-1 to184-4 to each other.

The first position sensor 170 may be embodied as a Hall sensor, forexample, but may be embodied as any sensor as long as it is able todetect the intensity of a magnetic field. If the first position sensor170 is embodied as a Hall sensor, the hall sensor may include aplurality of pins.

For example, the plurality of pins may include input pins Pll and P12and output pins P21 and P22. Signals output through the output pins P21and P22 may be a current type or a voltage type.

The input pins Pll and P12 and the output pins P21 and P22 of the firstposition sensor 170 may be conductively connected to the respectiveelastic member contact portions 184-1 to 184-4 via the circuit patternL1 to L4.

For example, referring to FIG. 5C, the first line L1 of the circuitpattern may conductively connect the first pin P11 to the fourth elasticmember contact portion 184-4, and the second line L2 of the circuitpattern may conductively connect the second input pin P12 to the thirdelastic member contact portion 184-3. In addition, the third line L3 ofthe circuit pattern may conductively connect the first output pin P21 tothe first elastic member contact portion 184-1, and the fourth line L4of the circuit pattern may conductively connect the second output pinP22 to the second elastic member contact portion 184-2.

In an embodiment, the first to fourth lines L1 to L4 may be formed so asto be visible to the naked eye. In another embodiment, the first tofourth lines L1 to L4 may be formed in the body 182 of the sensor board180 so as not to be visible to the naked eye.

Next, the housing 140 will be described.

The housing 140 may support the first magnet 190 for detection and themagnet 130 for driving, and may accommodate the bobbin 110 therein suchthat the bobbin 110 is allowed to move in the first direction.

The housing 140 may generally have a hollow column shape. For example,the housing 140 may have a polygonal (e.g., a square or octagonal) orcircular bore.

FIG. 6 is a top perspective view of the housing 140 illustrated in FIG.2. FIG. 7 is a bottom exploded perspective view of the housing 140, thefirst magnet 190 and the second magnet 130, which are illustrated inFIG. 2. FIG. 8 is a sectional view taken along line I-I′ in FIG. 3. FIG.9 is a top perspective view of the coupled state of the bobbin 110, thehousing 140, the upper elastic member 150, the first position sensor170, the sensor board 180, and the support members 220, which areillustrated in FIG. 2. FIG. 10 is a bottom perspective view of thecoupled state of the bobbin 110, the housing 140, the lower elasticmember 160, and the support members 220, which are illustrated in FIG.2.

The housing 140 may have the first seating groove 146 formed at aposition thereof corresponding to the first and second protrusions 111and 112 of the bobbin 110.

The housing 140 may include a third protrusion 148, which corresponds tothe space defined between the first and second protrusions 111 and 112,and which has a first width W1.

The third protrusion 148 of the housing 140, which is opposite to thebobbin 110, may have a surface having the same shape as the side portionof the bobbin 110. Here, there may be a predetermined difference betweenthe first width W1 between the first and second protrusions 111 and 112of the bobbin 110, which is illustrated in FIG. 4, and the second widthW2 of the third protrusion 148 of the housing 140, which is illustratedin FIG. 4. Consequently, it is possible to restrict the rotation of thethird protrusion 148 between the first and second protrusions 111 and112 of the bobbin 110. As a result, it is possible for the thirdprotrusion 148 of the housing 140 to inhibit the bobbin 110 from beingrotated even if the bobbin 110 receives force in the direction in whichthe bobbin 110 is rotated about the optical axis, rather than beingrotated in the optical axis direction.

For example, the upper edge of the outer periphery of the housing 140may have a square plan shape, whereas the lower edge of the innerperiphery may have an octagonal plan shape, as exemplarily illustratedin FIGS. 6 and 7. The housing 140 may include a plurality of sideportions. For example, the housing 140 may include four first sideportions 141 and four second side portions 142, and the width of each ofthe first side portions 141 may be greater than the width of each of thesecond side portions 142.

The first side portions 141 of the housing 140 may correspond to theportions on which the second magnet 130 is mounted. Each of the secondside portions 142 of the housing 140 may be disposed between the twoadjacent first side portions 141, and may correspond to portions onwhich the support members 220 are disposed. Each of the first sideportions 141 of the housing 140 may connect the two adjacent second sideportions 142 of the housing 140, and may have flat surfaces having apredetermined depth.

Each of the first side portions 141 of the housing 140 may have asurface area that is equal to or larger than the surface area of thesecond magnet 130, which corresponds to the first side portion 141.

The housing 140 may have a first magnet seat 141 b for accommodating thefirst magnet 190 and second magnet seats 141 a for accommodating thesecond magnets 130-1 to 130-4.

For example, the housing 140 may have the first magnet seat 141 b, whichis formed in the upper end of the outer portion of one of the first sideportions 141, and the second magnet seats 141 a, which are formed in thelower end of the inner portion of the first side portions 141.

The first magnet seat 141 b may be positioned above the second magnetseats 141 a.

The first magnet 190 may be fitted in and secured to the first magnetseat 141 b, and each of the second magnets 130-1 to 130-4 may be fixedto the second magnet seat 141 a, which is provided on a correspondingone of the first side portions 141 of the housing 140.

The second magnet seat 141 a of the housing 140 may be configured tohave the form of a recess having a size corresponding to the size of themagnet 130, and may be configured to face at least three of the surfacesof the second magnet 130, that is, two lateral side surface and theupper surface of the second magnet 130.

An opening may be formed in the bottom surface of the second magnet seat141 a of the housing 140, that is, the surface that is opposite thesecond coil 230, which will be described later, and the bottom surfaceof the second magnet 130 seated on the second magnet seat 141 a maydirectly face the second coil 230.

The first and second magnets 190 and 130 may be secured to the first andsecond magnet seats 141 b and 141 a of the housing 140 using anadhesive, without being limited thereto, and an adhesive member such asa piece of double-sided tape may be used.

Alternatively, the first and second magnet seats 141 b and 141 a of thehousing 140 may be configured as mounting holes, which allow the firstand second magnets 190 and 130 to be partially fitted thereinto or to bepartially exposed therefrom, rather than being configured as the recessillustrated in FIGS. 6 and 7.

For example, the first magnet 190 may be positioned above one (forexample, 130-1) of the second magnets 130-1, 130-2, 130-3 and 130-4.

The first magnet 190 may be disposed so as to be spaced apart from thesecond magnet (for example, 130-1). The housing 140 may be partiallydisposed between the first magnet 190 and the second magnet (forexample, 130-1). In another embodiment, the first magnet 190 and thesecond magnet 130-1 may be in contact with each other.

The first side portion 141 of the housing 140 may be oriented parallelto the side surface of the cover member 300. In addition, the first sideportion 141 of the housing 140 may be larger than the second sideportion 142. The second side portion 142 of the housing 140 may beprovided with paths through which the support members 220 extend. Firstthrough-holes 147 may be formed in the upper portion of the second sideportion 142 of the housing 140. The support members 220 may be connectedto the upper elastic member 150 through the first through holes 147.

In addition, in order to inhibit the housing 140 from directly collidingwith the inner side surface of the cover member 300 illustrated in FIG.1, the housing 140 may be provided at the upper end thereof with asecond stopper 144.

The housing 140 may include at least one first upper support protrusion143, formed on the upper surface thereof for the coupling of the upperelastic member 150.

For example, the first upper support protrusion 143 of the housing 140may be formed on the upper surface of the second side portion 142 of thehousing 140. The first upper support protrusion 143 of the housing 140may have a semispherical shape, as illustrated in the drawings, or mayhave a cylindrical shape or a prism shape, without being limitedthereto.

The housing 140 may have second a lower support protrusion 145 formed onthe lower surface thereof for the coupling and fixing of the lowerelastic member 160.

In order to define paths for the passage of the support members 220 andto ensure the space to be filled with gel-type silicone, which serves asa damper, the housing 140 may have a first recess 142 a formed in thesecond side portion 142. In other words, the first recess 142 a of thehousing 140 may be filled with damping silicone.

The housing 140 may have a plurality of third stoppers 149 protrudingfrom the side portions 141 thereof. The third stoppers 149 serve toinhibit the housing 140 from colliding with the cover member 300 whenthe housing 140 moves in the second and third directions.

In order to inhibit the bottom surface of the housing 140 from collidingwith the base 210 and/or the circuit board 250, which will be describedbelow, the housing 140 may further have a fourth stopper (not shown)protruding from the bottom surface thereof. Through this configuration,the housing 140 may be spaced apart from the base 210, which is disposedthereunder, and may be spaced apart from the cover member 300, which isdisposed thereabove, with result that the housing 140 may be maintainedat a predetermined position in the optical axis direction withoutinterference therebetween. In this way, the housing 140 may perform ashifting action in the second and third direction, that is, theanteroposterior direction and the lateral direction, on a planeperpendicular to the optical axis.

Next, the first magnet 190 and the second magnet 130 will be described.

The second magnet 130 may be disposed on the second magnet seat 141 a ofthe housing 140 so as to overlap the first coil 120 in the directionperpendicular to the optical axis.

In another embodiment, the first and second magnets 190 and 130 may bedisposed together outside or inside the first side portion 141 of thehousing 140, or may be disposed together inside or outside the secondside portion 142 of the housing 140.

In a further embodiment, the first magnet 190 may be accommodated in theinner portion of the first side portion 141 of the housing 140, and thesecond magnet 130 may be accommodated in the outer portion of the firstside portion 141 of the housing 140.

The second magnet 130 may have a form that corresponds to the first sideportion 141 of the housing 140, that is, the form of an approximatelyrectangular parallelepiped. The surface of the second magnet 130 thatfaces the first coil 120 may have a radius of curvature that correspondsto that of the first coil 120.

The second magnet 130 may be configured as a single body. In theembodiment, referring to FIG. 5A, the second magnet 130 may be orientedsuch that the surface thereof facing the first coil 120 is the S-pole132 and the opposite surface is the N-pole 134, without being limitedthereto, and the opposite configuration is also possible.

At least two second magnets 130 may be provided, and in the embodiment,four second magnets 130 may be installed. The second magnet 130 may havean approximately rectangular shape, as illustrated in FIG. 5A, or mayhave a triangular or diamond shape.

Although the surface of the second magnet 130 that faces the first coil120 may be linear, the disclosure is not limited thereto. When thecorresponding surface of the first coil 120 is curved, the surface ofthe second magnet 130 that faces the first coil 120 may be curved so asto have a radius of curvature corresponding to the surface of the firstcoil 120.

By virtue of this configuration, it is possible to keep the distancebetween the second magnet 130 and the first coil 120 constant. In anembodiment, four first side portions 141 of the housing 140 may beprovided with the second magnets 130-1, 130-2, 130-3 and 130-4,respectively, without being limited thereto. In some designs, only oneof the second magnet 130 and the first coil 120 may have a flat surface,and the other of the second magnet 130 and the first coil 120 may have acurved surface. Alternatively, both the first coil 120 and the secondmagnet 130, which face each other, may have curved surfaces. In thiscase, the surface of the first coil 120 may have the same radius ofcurvature as the surface of the second magnet 130.

When the second magnets 130 have a rectangular flat surface, asillustrated in FIG. 5A, a pair of magnets, among the plurality ofmagnets 130, may be arranged in the second direction so as to beparallel to each other, and the other pair of magnets may be arranged inthe third direction so as to be parallel to each other. By virtue of thearrangement, it is possible to control the movement of the housing 140for handshake compensation, which will be described later.

Next, the upper elastic member 150, the lower elastic member 160, andthe support members 220 will be described.

The upper elastic member 150 and the lower elastic member 160elastically support the bobbin 110. The support members 220 may supportthe housing 140 so as to be movable relative to the base 210 in thedirection perpendicular to the optical axis, and may conductivelyconnect at least one of the upper and lower elastic members 150 and 160to the circuit board 250.

FIG. 11 is an assembled perspective view illustrating the upper elasticmember 150, the lower elastic member 160, the first position sensor 170,the sensor board 180, the base 210, the support members 220, and thecircuit board 250, which are illustrated in FIG. 2.

The upper elastic member 150 may include a plurality of upper elasticmembers 150-1 to 150-4, which are conductively separated and spacedapart from one another.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may be conductively connected to at least one of the upper elasticmember 150 and the lower elastic member 160.

For example, although FIG. 11 illustrates that the elastic membercontact portions 184-1 to 184-4 of the sensor board 180 come intoelectrical contact with the upper elastic members 150-1 to 150-4, thedisclosure is not limited thereto. In another embodiment, the elasticmember contact portions 184-1 to 184-4 of the sensor board 180 may comeinto electrical contact with the lower elastic member 160, or may comeinto electrical contact with both the upper elastic member 150 and thelower elastic member 160.

Each of the respective elastic member contact portions 184-1 to 184-4 ofthe sensor board 180, which are conductively connected to the firstposition sensor 170, may be conductively connected to a correspondingone of the upper elastic members 150-1 to 150-4. Each of the upperelastic members 150-1 to 150-4 may be conductively connected to acorresponding one of the support members 220-1 to 220-4.

Each one 150 a of the first and third upper elastic members 150-1 and150-3 may include a first inner frame 151, a first outer frame 152 a,and a first frame connector 153.

Each one 150 b of the second and fourth upper elastic members 150-2 and150-4 may include the first inner frame 151, a first outer frame 152 b,and the first frame connector 153.

The first inner frame 151 of the first to fourth upper elastic members150-1 to 150-4 may be coupled to a corresponding one of the bobbin 110and the elastic member contact portions 184-1 to 184-4.

As illustrated in FIG. 4, when the upper surface 112 a of the secondprotrusion 112 of the bobbin 110 is flat, the first inner frame 151 ofthe upper elastic member 150 may be placed on the upper surface 112 a ofthe second protrusion 112 of the bobbin 110, and may be secured theretousing an adhesive member.

The first outer frame 152 a and 152 b may be coupled to the housing 140,and may be connected to the support members 220. The first frameconnector 153 of each of the upper elastic members 150-1 to 150-4 mayconnect the first inner frame 151 to the first outer frame 152 a or 152b. Although the first outer frame 152 b may be formed by bisecting thefirst outer frame 152 a, the disclosure is not limited thereto. Inanother embodiment, the first outer frame 152 a may be bisected so as tohave the same shape as the first outer frame 152 b.

The first frame connector 153 may be bent at least one time so as toform a predetermined pattern. Upward and/or downward movement of thebobbin 110 in the first direction may be elastically supported viapositional variation and fine deformation of the first frame connector153.

The first outer frame 152 a or 152 b of the upper elastic member 150illustrated in FIG. 11 may be coupled and secured to the housing 140 bymeans of the first upper support protrusion 143 of the housing 140. Inthe embodiment, each of the first outer frames 152 a and 152 b may beformed with a second of second through-hole 157, which has a shape andposition corresponding to those of the first upper support protrusion143. Here, the first upper support protrusion 143 and the second ofsecond through-hole 157 may be fixed to each other via thermal fusion,or using an adhesive such as, for example, epoxy.

By virtue of conductive connections between the elastic member contactportions 184-1 to 184-4 of the sensor board 180 and the first to fourthupper elastic members 150-1 to 150-4, four pins Pll to P22 of the firstposition sensor 170 may be conductively connected to the first to fourthupper elastic members 150-1 to 150-4.

The respective first to fourth upper elastic members 150-1 to 150-4 maybe connected to the circuit board 250 via the support members 220. Thatis, the first upper elastic members 150-1 may be conductively connectedto the circuit board 250 via at least one of the first of first andsecond of first support members 220-la and 220-1 b, and the second upperelastic members 150-2 may be conductively connected to the circuit board250 via the second support members 220-2. The third upper elasticmembers 150-3 may be conductively connected to the circuit board 250 viaat least one of the first of third and second of third support members220-3 a and 220-3 b, and the fourth upper elastic members 150-4 may beconductively connected to the circuit board 250 via the fourth supportmembers 220-4.

The first position sensor 170 may receive a drive signal, for example,driving current or driving voltage, from the circuit board 250 throughtwo of the first to fourth upper elastic members 150-1 to 150-4 and thesupport members connected to the upper elastic members (for example,220-1 and 220-2).

In addition, the first position sensor 170 may output an output signalthereof to the circuit board 250 through the remaining two of the firstto fourth upper elastic members 150-1 to 150-4 and the support membersconnected to the upper elastic members (for example, 220-3 and 220-4).

Meanwhile, the lower elastic member 160 may include first and secondlower elastic members 160-1 and 160-2, which are conductively separatedand spaced apart from each other. The first coil 120 may be connected tothe support members 220 through the first and second lower elasticmembers 160-1 and 160-2.

Each of the first and second lower elastic members 160-1 and 160-2 mayinclude at least one second inner frame 161-1 or 161-2, at least onesecond outer frame 162-1 or 162-2, and at least one second frameconnector 163-1 or 163-2.

The second inner frames 161-1 and 161-2 may be coupled to the bobbin110, and the second outer frames 162-1 and 162-2 may be coupled to thehousing 140.

The first of second frame connector 163-1 may connect the second innerframe 161-1 and the second outer frame 162-1 to each other, the secondof second frame connector 163-2 may connect the second inner frame 161-2and the second outer frame 162-2 to each other, and the third of secondframe connector 163-3 may connect the second inner frame 161-2 and thesecond outer frame 162-2 to each other.

The first lower elastic member 160-1 may further include a first coilframe 164-1, and the second lower elastic member 160-2 may furtherinclude the second coil frame 164-2.

Referring to FIG. 11, each of the first and second coil frames 164-1 and164-2 of the lower elastic member 160 may be connected to acorresponding one of two ends of the first coil 120. The first andsecond lower elastic members 160-1 and 160-2 may receive drive signals,for example drive current, from the circuit board 250, and may transferthe drive current to the first coil 120.

Each of the first and second lower elastic members 160-1 and 160-2 mayfurther include a fourth of second frame connector 163-4. The fourth ofsecond frame connector 163-4 may connect the coil frame 164 to thesecond inner frame 161-2.

At least one of the first of second to fourth of second frame connectors163-1 to 163-4 may be bent once or more so as to define a predeterminedpattern. In Particular, by positional variation and fine deformation ofthe first of second and third of second frame connectors 163-1 and163-3, upward and/or downward movement of the bobbin 110 in the firstdirection, parallel to the optical axis, may be elastically supported.

In an embodiment, each of the first and second lower elastic members160-1 and 160-2 may further include a bent portion 165, which isconnected to one of the upper elastic members. For example, the bentportion 165 may be bent at the second of second frame connector 163-2toward the upper elastic member 150 in the first direction.

The upper elastic member 160 may further include fifth and sixth upperelastic members 150-5 and 150-6. The first to sixth upper elasticmembers 150-1 to 150-6 may be conductively separated and spaced apartfrom one another.

Each of the fifth and sixth upper elastic members 150-5 and 150-6 mayinclude a connecting frame 154 and a second of first outer frame 1550.

The connecting frame 154 of each of the fifth and sixth upper elasticmembers 150-5 and 150-6 may be connected to a corresponding one of thefirst and second lower elastic members 160-1 and 160-2, and may extendin the first direction.

The second of first outer frame 155 may be bent at the connecting frame154 in the direction perpendicular to the first direction, and may becoupled to the housing 155. The second of first outer frame 155 may beconnected to the support member 220.

The fifth upper elastic member 150-5 may be connected to the fifthsupport member 220-5, and the sixth upper elastic member 150-6 may beconnected to the sixth support member 220-6.

For example, the bent portion 165 of each of the first and second lowerelastic members 160-1 and 160-2 may be integrally formed with theconnecting frame 154 of the fifth or sixth upper elastic member 150-5 or150-6 and the second of first outer frame 155.

For example, each of the fifth and sixth upper elastic members 150-5 and150-6 may include the connecting frame 154, which is bent at the secondof first outer frame 155 so as to be parallel to the first direction,and each of the first and second lower elastic members 160-1 and 160-2may include the bent portion 165, which is bent at the second of secondframe connector 163-2 so as to be parallel to the first direction. Theconnecting frame 154 may be connected to the bent portion 165.

The first and second lower elastic members 160-1 and 160-2 may receivedrive signals from the circuit board 250 via the fifth and sixth upperelastic members 150-5 and 150-6, which are connected to the supportmembers 220-5 and 220-6, and may transfer the drive signals to the firstcoil 120. Specifically, the first lower elastic member 160-1 may beconnected to the circuit board 250 via the sixth upper elastic member150-6 and the sixth support member 220-6, and the second lower elasticmember 160-2 may be connected to the circuit board 250 via the fifthupper elastic member 150-5 and the fifth support member 220-5.

Although each of the upper and lower elastic members 150 and 160 of theembodiment is divided into two or more parts, in another embodiment,each of the upper and lower elastic members 150 and 160 may not bedivided.

The second support protrusion 117 of the bobbin 110 may couple andsecure the second inner frame 161-1 or 161-2 of the lower elastic member160 to the bobbin 110. The second lower support protrusion 145 of thehousing 140 may couple and secure the second outer frame 162-1 or 162-2of the lower elastic member 160 to the housing 140.

Each of the second inner frames 161-1 and 161-2 of the first and secondlower elastic members 160-1 and 160-2 may be provided with a thirdthrough hole 161 a, which is formed at a position corresponding to thefirst lower support protrusion 117 of the bobbin 110 so as to have ashape corresponding to the first lower support protrusion 117 of thebobbin 110. Here, the first lower support protrusion 117 of the bobbin110 and the third through hole 161 a may be secured to each other viathermal fusion, or using an adhesive member such as epoxy.

Each of the second outer frames 162-1 and 162-2 of the first and secondlower elastic members 160-1 and 160-2 may be provided with a fourththrough hole 162 a at a position corresponding to the second lowersupport protrusion 145 of the housing 140. Here, the second lowersupport protrusion 145 of the housing 140 and the fourth through hole162 a may be secured to each other via thermal fusion, or using anadhesive member such as epoxy.

Although each of the upper elastic member 150 and the lower elasticmember 160 may be constituted by a leaf spring, the disclosure is notrestricted as to the material used for the upper and lower elasticmembers 150 and 160.

The power may be supplied to the first position sensor 170 via two upperelastic members 150, which are conductively separated from each other,signals output from the first position sensor 170 may be transferred tothe circuit board 250 via the other two upper elastic members 150, whichare conductively separated from each other, and power may be supplied tothe first coil 120 via two lower elastic members 160, which areconductively separated from each other. However, the disclosure is notlimited thereto.

In another embodiment, the role of the upper elastic members 150 and therole of the lower elastic members 160 may be exchanged. Specifically,power may be supplied to the first coil 120 via two upper elasticmembers 150, which are conductively separated from each other, power maybe supplied to the first position sensor 170 via two lower elasticmembers 160, which are conductively separated from each other, andsignals output from the first position sensor 170 may be transferred tothe circuit board 250 via the other two lower elastic members 160, whichare conductively separated from each other. Although this arrangement isnot illustrated in the drawings, it will be apparent from the drawings.

Next, the support members 220 will be described.

The plurality of support members 220-1 to 220-6 may be disposed atrespective second side portions 142. For example, two support membersmay be disposed at each of the four second side portions 142.

In another embodiment, only one support member may be disposed at eachof two side portions 142 among the four second side portions 142 of thehousing 140, and two support members may be disposed at each of theother two side portions 142.

In a further embodiment, the support members 220 may be disposed in theform of a leaf spring at the first side portions of the housing 140.

The support members 220 may conductively connect the upper elasticmember 150 and the circuit board 250 to each other. As described above,the support members 220 may form paths through which the power requiredby the first position sensor 170 and the first coil 120 is transferred,and may form paths through which signals output from the first positionsensor 170 are supplied to the circuit board 250.

The support members 220 may be embodied as members for elastic support,for example leaf springs, coil springs, suspension wires or the like. Inanother embodiment, the support members 220 may be integrally formedwith the upper elastic member.

Next, the base 210, the circuit board 250, and the second coil 230 willbe described.

The base 210 may have a bore corresponding to the bore of the bobbin 110and/or the bore of the housing 140, and may have a shape thatcorresponds to that of the cover member 300, for example, a squareshape.

FIG. 12 is an exploded perspective view of the base 210, the second coil230, and the circuit board 250, which are illustrated in FIG. 2.

Referring to FIG. 12, the base 210 may have a stepped portion 211, towhich an adhesive may be applied when the cover member 300 is secured tothe base 210 using the adhesive. Here, the stepped portion 211 may guidethe cover member 300 coupled to the upper side thereof, and may becoupled to the end of the cover member 300 in a surface-contact manner.

The stepped portion 211 of the base 210 and the end of the cover member300 may be attached or secured to each other using, for example, anadhesive.

The base 210 may be provided with a support portion 255 having acorresponding size on the surface thereof facing the terminal 251 of thecircuit board 250. The support portion 255 of the base 210 may be formedon the outer side surface of the base 210, which does not have thestepped portion 211, and may support a terminal rib 253 of the circuitboard 250.

A second recess 212 may be formed in each corner of the cover member300. When the cover member 300 has a protrusion formed at each cornerthereof, the protrusion of the cover member 300 may be fitted into thesecond recess 212 in the base 210.

In addition, seating recesses 215-1 and 215-2 may be formed in the uppersurface of the base 210 so that the second position sensor 240 may bedisposed in each of the seating recesses 215-1 and 215-2. In anembodiment, the base 210 may be provided with two seating recesses 215-1and 215-2, in which the second position sensors 240 may be disposed, soas to detect the extent to which the housing 140 moves in the second andthird directions. To this end, although an angle defined between theimaginary lines, which are connected from the centers of the seatingrecesses 215-1 and 215-2 to the center of the base 1210, may be an angleof 90°, the disclosure is not limited thereto.

The seating recesses 215-1 and 215-2 in the base 210 may be disposed ator near the centers of the respective second coils 230, or the centersof the second coils 230 may coincide with the centers of the secondposition sensors 240.

The second coil 230 may be disposed above the circuit board 250, and thesecond position sensor 240 may be disposed under the circuit board 250.The second position sensor 240 may detect displacement of the housing140 relative to the base 210 in directions (the X-axis or y-axisdirection) perpendicular to the optical axis (that is, the z-axis).

The second position sensor 240 may include two sensors 240 a and 240 b,which are disposed to be perpendicular to each other so as to detectdisplacement of the housing 140 in the direction perpendicular to theoptical axis.

The circuit board 250 may be disposed on the upper surface of the base210, and may have a bore corresponding to the bore of the bobbin 110,the bore of the housing 140 and/or the bore of the base 210. The outercircumferential surface of the circuit board 250 may have a shape thatcoincides with or corresponds to the upper surface of the base 210, forexample, a square shape.

The circuit board 250 may include at least one terminal rib 253, whichis bent at the upper surface thereof and is provided with a plurality ofterminals or pins 251, which receive electrical signals from theoutside.

In FIG. 12, the second coil 230 is implemented as being provided on thecircuit member 231, which is separate from the circuit board 250,without being limited thereto. In another embodiment, the second coil230 may take the form of a ring-shaped coil block, an FP coil, or acircuit pattern formed on the circuit board 250.

The second coil 230 may have through-holes 230 a formed in the circuitmember 231. The support members 220 may extend through the through-holes230 a so as to be conductively connected to the circuit board 250.

The second coil 230 is located above the circuit board 250 so as to beopposite the second magnet 130 secured to the housing 140.

Although four second coils 230 may be installed on four sides of thecircuit board 250, the disclosure is not limited thereto, and only twosecond coils may be installed respectively in the second direction andthe third direction, or four or more second coils may be installed.

The housing 140 may move in the second direction and/or the thirddirection via interaction of the magnet 130 and the second coil 230,which are arranged to be opposite each other as described above, therebyperforming handshake compensation.

The second position sensor 240 may be embodied as a Hall sensor, or anyother sensor may be used as long as it can detect the strength of amagnetic field. For example, the second position sensor 240 may take theform of a driver that includes a Hall sensor, or may be embodied as aposition detection sensor alone, such as, for example, a Hall sensor.

A plurality of terminals 251 may be installed on the terminal rib 253 ofthe circuit board 250. For example, the circuit board 250 may receivedrive signals through the plurality of terminals 251 installed on theterminal rib 253, and may supply the drive signals to the first andsecond coils 120 and 230 and the first and second position sensors 170and 240. The circuit board 250 may outwardly output signals receivedfrom the first and second position sensors 170 and 240.

In the embodiment, although the circuit board 250 may be embodied as aFlexible Printed Circuit Board (FPCB), the disclosure is not limitedthereto. The terminals 251 of the circuit board 250 may be directlyformed on the surface of the base 210 via, for example, a surfaceelectrode process.

The circuit board 250 may have through holes 250 a 1 and 250 a 2 throughwhich the support members 220 extend. The support members 220 may beconductively connected to the respective circuit patterns formed on thebottom surface of the circuit board 250 via soldering or the like.

In another embodiment, the circuit board 250 may not have the throughholes 150 a 1 and 250 a 2, and the support members 220 may beconductively connected to the respective circuit patterns formed on theupper surface of the circuit board 250 via soldering or the like.

The circuit board 250 may further have a through hole 250 b, which iscoupled to an upper support protrusion 217 of the base 210. The uppersupport protrusion 217 of the base 210 and the through hole 250 b of thecircuit board 250 may be coupled to each other, as illustrated in FIG.11, and may be secured to each other via an adhesive member such asepoxy.

Generally, as the movable unit moves, the intensity of a magnetic field,which a position sensor for auto-focusing detects, may have a positivevalue in a first quadrant and a negative value in a third quadrant basedon a x-y coordinate system having the origin (0, 0) as a referencepoint. Here, the reference point may be the point at which the intensityof a magnetic field is zero. In order to facilitate calibration requiredfor driving of auto-focusing, a linear range in the first and thirdquadrants of a graph, which represents the intensity of a magnetic fieldas detected by a position sensor for auto-focusing, based on the origin,may be used as a control range for the driving of auto-focusing. Theintensity of the magnetic field may be affected by variation in theambient temperature around a position sensor and a magnet.

FIG. 13 illustrates variation in the intensity of a magnetic fieldrelative to variation in ambient temperature.

The horizontal axis (X-axis) represents the distance that the movableunit moves, and the vertical axis (Y-axis) represents the intensity of amagnetic field of a magnet, for example a driving magnet, which isdetected by the position sensor for auto-focusing when the movable unitmoves.

Graph G1 represents the intensity of a magnetic field of the drivingmagnet, which is detected by the position sensor for auto-focusing atthe ambient temperature when the movable unit moves, and graph G2represents the intensity of a magnetic field of the driving magnet,which is detected by the position sensor for auto-focusing when theambient temperature around the position sensor for auto-focusing and thedriving magnet rises (for example, to 60° C.). FIG. 13 containscharacteristic illustration of the intensity of a magnetic field of thedriving magnet and the temperature of the position sensor (for example,a Hall sensor) relative to the temperature of the magnet.

Referring to FIG. 13, it is noted that there is a difference betweengraph G1 and graph G2.

In the case in which the ambient temperature around the position sensorfor auto-focusing rises, as the movable unit moves far away from thereference point at which the intensity of a magnetic field is zero, thegraph representing the intensity of a magnetic field in the firstquadrant may fall, and the graph representing the intensity of amagnetic field in the third quadrant may rise. In addition, as themovable unit moves far away from the reference point at which theintensity of a magnetic field is zero, the deviation between theintensities of the magnetic field (deviation between G1 and G2) due totemperature variation may increase.

The graph representing the intensity of a magnetic field varies inopposite directions in the first and third quadrants with the increasein temperature. Accordingly, the accuracy and reliability of driving ofauto-focusing may decreases when both the first and third quadrants areused as a control range, which is required for driving of auto-focusing.

In order to reduce the effect of the difference in the intensities ofthe magnetic fields, which is caused by variation in temperature, theembodiment uses only one of the first and third quadrants as the controlrange for driving auto-focusing. To this end, the first magnet 190,which is an additional detection magnet, is further provided in additionto the second magnet 130, which is a driving magnet.

When the ambient temperature around the movable unit varies, the focallength of a lens mounted on the lens moving apparatus may also beaffected. For example, when the ambient temperature around the movableunit rises, the focal length of the lens may increase.

Accordingly, when an auto-focusing motion is performed in the state inwhich the ambient temperature around the movable unit increases, thelens may become out of focus due to the effect of temperature.

From graph G1 and graph G2 in FIG. 13, it will be appreciated that thegraph representing the intensity of a magnetic field is lowered in thefirst quadrant as the ambient temperature around the movable unit rises.

Since the graph representing the intensity of a magnetic field in thefirst quadrant is lowered with the variation in temperate, it ispossible to automatically compensate for the increase in focal length ofthe lens due to variation in temperature. For this reason, theembodiment may adopt only the first quadrant as the area of use for avoice coil motor (VCM).

The embodiment may include the first magnet 190 in addition to thesecond magnet 130. The first position sensor 170 may detect the sum ofthe intensity of the magnetic field of the second magnet 130 and theintensity of the magnetic field of the first magnet 190.

FIG. 14 illustrates the intensity f2 of a magnetic field of the firstmagnet 190, the intensity f1 of the magnetic field of the second magnet130, and the sum f3 of the intensity f2 of the magnetic field of thefirst magnet 190 and the intensity f1 of the magnetic field of thesecond magnet 130. FIG. 15 illustrates the range of use of the intensityof a magnetic field according to the embodiment. g1 represents theintensity of a magnetic field of the second magnet 130, which is appliedto the first position sensor 170, relative to displacement of themovable unit, g2 represents the intensity of a magnetic field of thefirst magnet 190, which is applied to the first position sensor 170,relative to displacement of the movable unit, and g3 represents the sumof the intensity of a magnetic field of the first magnet 190 and theintensity of a magnetic field of second magnet 130, which are detectedby the first position sensor 170, relative to displacement of themovable unit.

Referring to FIGS. 14 and 15, the range in which the sum of theintensities of the magnetic fields, detected by the first positionsensor 170 as the bobbin 110 moves, is zero or greater, is set to be theregion of use in displacement of the bobbin 110.

Referring to FIG. 15, the range of displacement of the bobbin 110, inwhich the sum of the intensities of magnetic fields is zero or greater,may be a range of about -0.15 mm to 0.52 mm. For example, assuming thatthe initial position of the bobbin 110 is the origin, the range of usein displacement of the bobbin 110 with respect to the origin, which isthe initial position of the bobbin 110, may be a range of −0.15 mm to0.52 mm. In the range of use in displacement of the bobbin 110 accordingto the embodiment (−0.15 mm to 0.52 mm), the intensity of the magneticfield of the first magnet 190 may be positive, the intensity of themagnetic field of the second magnet 130 may be positive, and the sum ofthe intensity of the magnetic field of the first magnet 190 and theintensity of the magnetic field of the second magnet 130 may bepositive.

FIG. 16 illustrates the relative positional relationship of the firstposition sensor 170, the first magnet 190 and the second magnet 130 whenthe movable unit is disposed at the initial position.

Referring to FIG. 16, the first coil 120 may be disposed at the lowerside of the outer circumferential surface of the bobbin 110, and thefirst position sensor 170 may be disposed at the upper side of the outercircumferential surface of the bobbin 110 so as to be spaced apart fromthe first coil 120.

The second magnet 130 may be mounted on the housing 140 so as to facethe first coil 120. For example, the second magnet 130 may be disposedso at to overlap the first coil 120 in the direction perpendicular tothe first direction. The first direction may be the optical axisdirection.

The second magnet 130 may be a monopole-magnetized magnet, which hasdifferent polarities at the inner and outer sides thereof.

The boundary plane between the S pole and the N pole of the secondmagnet 130 may be perpendicular to the direction in which the secondmagnet 130 and the first coil 120 face each other.

For example, the boundary plane between the S pole and the N pole of thesecond magnet 130 may be oriented in the direction perpendicular to thedirection in which the second magnet 130 and the first coil 120 faceeach other.

For example, although the second magnet 130 may be disposed on thehousing 140 such that the surface thereof that faces the first coil 120is an S pole and the opposite surface thereof is an N pole, thedisclosure is not limited thereto, and the reverse disposition is alsopossible.

The first magnet 190 may be disposed or mounted on the housing 140 so asto be positioned above the second magnet 130. The first magnet 190 maybe a monopole-magnetized magnet, which has different polarities at theupper and lower sides thereof.

The boundary plane between the S pole and the N pole of the first magnet190 disposed on the housing 140 may be parallel to the boundary planebetween the S pole and the N pole of the second magnet 130, withoutbeing limited thereto. In another embodiment, an imaginary planeparallel to the first boundary plane between the S pole and the N poleof the first magnet 190 disposed on the housing 140 may intersect asecond imaginary plane parallel to the second boundary plane between theS pole and the N pole of the second magnet 130.

Although the first magnet 190 may have a smaller size than the secondmagnet 130, the disclosure is not limited thereto. The first magnet 190may be disposed at the upper side of the second magnet 130 so as to bespaced apart from the second magnet 130. For example, the first magnet190 may at least partially overlap the second magnet 130 in the firstdirection, without being limited thereto.

When the movable unit is located at the initial position, the firstposition sensor 170 may be disposed on the outer circumferential surfaceof the bobbin 110 so as to be positioned in or aligned with the spacebetween the second magnet 130 and the first magnet 190 in the firstdirection.

For example, the movable unit of the lens moving apparatus may move fromthe initial position in the +z-axis direction or the −z-axis directiondue to electromagnetic interaction between the first coil 120 and thesecond magnet 130.

The movable unit may be an auto-focusing movable unit. The auto-focusingmovable unit may include the bobbin 110 and components that are mountedon the bobbin 110 and are moved therewith. For example, theauto-focusing movable unit may include at least the bobbin 110 and alens (not shown) mounted on the bobbin 110. In some embodiments, themovable unit may further include at least one of the first coil 120 andthe first position sensor 170.

The initial position may be the initial position of the movable unitwhen no power is applied to the first coil 120, or may be the positionat which the movable unit is disposed when the upper and lower elasticmembers 150 and 160 are elastically deformed by only the weight of themovable unit. At the initial position, the movable unit, for example thebobbin 110, may be spaced apart from the stationary unit, for examplethe housing 140, by means of the upper and lower elastic members 150 and160.

At the initial position, the first position sensor 170 may not overlapthe first magnet 190 or the second magnet 130 in the directionperpendicular to the first direction.

For example, the detecting portion 170 s (Hall element) of the firstposition sensor 170 may be positioned so as to face the outercircumferential surface of the bobbin 110. For example, the detectingportion 170 s of the first position sensor 170 may be disposed so as todetect the intensity of a magnetic field in which the line of magneticforce is directed from the inner circumferential surface toward theouter circumferential surface of the bobbin 110.

For example, at the initial position, the detecting portion 170 s of thefirst position sensor 170 may be disposed on the outer circumferentialsurface of the bobbin 110 so as to be positioned in or aligned with thespace between the second magnet 130 and the first magnet 190 in thefirst direction.

For example, at the initial position, the detecting portion 170 s of thefirst position sensor 170 may not overlap the first magnet 190 or thesecond magnet 130 in the direction perpendicular to the first direction.

At the initial position, the intensity of the magnetic field of thefirst magnet 190 and the intensity of the magnetic field of the secondmagnet 130, which are detected by the first position sensor 170, mayhave positive values. At the initial position, the sum of the intensityof the magnetic field of the first magnet 190 and the intensity of themagnetic field of the second magnet 130, which are detected by the firstposition sensor 170, may be positive.

FIG. 17A illustrates the relative positional relationship of the firstposition sensor 170, the first magnet 190 and the second magnet 130 whenthe movable unit is disposed at a first position. Here, the firstposition may be the highest position to which the movable unit is movedby the electromagnetic interaction between the first coil 120 and thefirst and second magnets 190 and 130.

Referring to FIG. 17A, at the first position, the detecting portion 170s of the first position sensor 170 may be aligned with the upper surface190 t of the first magnet 190 in the direction perpendicular to thefirst direction.

At the first position, the intensity of the magnetic field of each ofthe first magnet 190 and the second magnet 130 may have a positivevalue. At the first position, the sum of the intensity of the magneticfield of the first magnet 190 and the intensity of the magnetic field ofthe second magnet 130, which are detected by the first position sensor170, may have a positive value.

For example, the sum of the intensity of the magnetic field of the firstmagnet 190 and the intensity of the magnetic field of the second magnet130, which are detected by the first position sensor 170, while themovable unit moves upward from the initial position to the firstposition, may be included in the range of use of the VCM illustrated inFIG. 15, that is, the range of use in displacement of the bobbin 110.

FIG. 17B illustrates another embodiment of FIG. 17A.

Referring to FIG. 17B, the detecting portion 170 s of the first positionsensor 170 may be aligned with an imaginary line or plane, which isspaced apart from the upper surface 190 t of the first magnet 190 by afirst distance W1 in the direction perpendicular to the first direction.Here, the first distance W1 may be 100 μm or less.

In other words, even when the detecting portion 170 s of the firstposition sensor 170 moves upward beyond the upper surface 190 t of thefirst magnet 190 within the first distance W1, any of the intensity ofthe magnetic field of the first magnet 190, the intensity of themagnetic field of the second magnet 130, and the sum of both theintensities, which are detected by the first position sensor 170, mayhave a positive value.

Here, the first distance W1 may be the allowable range in which thedetecting portion 170 s of the first position sensor 170 can move upwardbeyond the upper surface 190 t of the first magnet 190. When thedetecting portion 170 s exceeds the allowable range, at least one of theintensity of the magnetic field of the first magnet 190, the intensityof the magnetic field of the second magnet 130, and the sum of both theintensities of the magnetic fields of the first and second magnets 190and 130, which are detected by the first position sensor 170, may have anegative value. This case may be out of the range of use of the VCMaccording to the embodiment of FIG. 15.

FIG. 18A illustrates the relative positional relationships of the firstposition sensor 170, the first magnet 190 and the second magnet 130 whenthe movable unit is disposed at a second position. Here, the secondposition of the movable unit may be the lowest position to which themovable unit is moved by the electromagnetic interaction between thefirst coil 120 and the first and second magnets 190 and 130.

Referring to FIG. 18A, at the second position, the detecting portion 170s of the first position sensor 170 may be aligned with the upper surface130 t of the second magnet 130 in the direction perpendicular to thefirst direction.

At the second position, any of the intensity of the magnetic field ofthe first magnet 190, the intensity of the magnetic field of the secondmagnet 130, and the sum of both the intensities, which are detected bythe first position sensor 170, may have a positive value.

Any of the intensity of the magnetic field of the first magnet 190, theintensity of the magnetic field of the second magnet 130, and the sum ofthe intensities of the magnetic fields of both the first and secondmagnets 190 and 130, which are detected by the first position sensor170, while the detecting portion moves downward from the initialposition to the second position, may have a positive value.

For example, the intensity of the magnetic field of the first magnet190, the intensity of the magnetic field of the second magnet 130, andthe sum of the intensities of the magnetic fields of the first andsecond magnets 190 and 130, which are detected by the first positionsensor 170, while the movable unit moves downward from the initialposition to the second position, may be included in the range of use ofthe VCM illustrated in FIG. 15.

FIG. 18B illustrates another embodiment of FIG. 18A.

Referring to FIG. 18B, the detecting portion 170 s of the first positionsensor 170 may be aligned with an imaginary line or plane, which isspaced apart from the upper surface 130 t of the second magnet 130 by asecond distance W2 in the direction perpendicular to the firstdirection. Here, the second distance W2 may be 100 μm or less.

In other words, even when the detecting portion 170 s of the firstposition sensor 170 moves downward beyond the upper surface 130 t of thesecond magnet 130 within the second distance W2, any of the intensity ofthe magnetic field of the first magnet 190, the intensity of themagnetic field of the second magnet 130, and the sum of the intensitiesof the magnetic fields of both the first and second magnets 190 and 130,which are detected by the first position sensor 170, may have a positivevalue.

Here, the second distance W2 may be the allowable range in which thedetecting portion 170 s of the first position sensor 170 can movedownward beyond the upper surface 130 t of the second magnet 130. Whenthe detecting portion 170 s exceeds the allowable range, at least one ofthe intensity of the magnetic field of the first magnet 190, theintensity of the magnetic field of the second magnet 130, and the sum ofthe intensities of the magnetic fields of both the first and secondmagnets 190 and 130, which are detected by the first position sensor170, may have a negative value. This case may be out of the range of useof the VCM according to the embodiment of the FIG. 15.

Any of the intensity of the magnetic field of the first magnet 190, theintensity of the magnetic field of the second magnet 130, and the sum ofthe intensities of the magnetic fields of both the first and secondmagnets 190 and 130, which are detected by the first position sensor170, while the bobbin 110 moves from the first position to the secondposition through the initial position, may have a positive value.

By virtue of the movement of the movable unit according to theembodiment, any of the intensity of the magnetic field of the firstmagnet 190, the intensity of the magnetic field of the second magnet130, and the sum of the intensities of the magnetic fields of both thefirst and second magnets 190 and 130, which are detected by the firstposition sensor 170, may have a positive value. As a result, theembodiment is able to inhibit the effects of deviation in the intensityof a magnetic field of the second magnet 130 due to variation intemperature.

In addition, the embodiment is able to automatically compensate forvariation in the focal length of the lens caused by variation intemperature by employing the range of use of the BCM illustrated in FIG.15 as the range of intensity of the magnetic field, which is detected bythe first position sensor 190 for the driving of auto-focusing.

Meanwhile, the lens moving apparatus according to the above-describedembodiment may be used in various fields such as, for example, a cameramodule. The camera module may be applied to, for example, a mobileappliance such as a cellular phone or the like.

FIG. 19 is an exploded perspective view illustrating a camera module 200according to an embodiment.

Referring to FIG. 19, the camera module may include a lens barrel 400,the lens moving apparatus, an adhesive member 612, a filter 610, a firstholder 600, a second holder 800, an image sensor 810, a motion sensor820, a handshake controller 830, and a connector 840.

The lens barrel 400 may be mounted in the bobbin 110 of the lens movingapparatus.

The first holder 600 may be located under the base 210 of the lensmoving apparatus. The filter 610 may be mounted on the first holder 600,and the first holder 600 may have a raised portion 500 on which thefilter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lensmoving apparatus to the first holder 600. In addition to the attachmentfunction described above, the adhesive member 612 may serve to inhibitcontaminants from entering the lens moving apparatus.

The adhesive member 612 may be, for example, epoxy, thermohardeningadhesive, or ultraviolet hardening adhesive.

The filter 610 may serve to inhibit light within a specific frequencyband, having passed through the lens barrel 400, from being introducedinto the image sensor 810. The filter 610 may be an infrared-lightblocking filter, without being limited thereto. Here, the filter 610 maybe oriented parallel to the X-Y plane.

The region of the first holder 600 in which the filter 610 is mountedmay be provided with a bore in order to allow the light that passesthrough the filter 610 to be introduced into the image sensor 810.

The second holder 800 may be disposed under the first holder 600, andthe image sensor 810 may be mounted on the second holder 800. The lightthat passes through the filter 610 is introduced into the image sensor810 so as to form an image on the image sensor 810.

The second holder 800 may include, for example, various circuits,devices, and a controller in order to convert the image, formed on theimage sensor 810, into electrical signals and to transmit the electricalsignals to an external component.

The second holder 800 may be embodied as a circuit board on which theimage sensor 810 may be mounted, a circuit pattern may be formed, andvarious devices may be coupled.

The image sensor 810 may receive an image contained in the lightintroduced through the lens moving apparatus, and may convert thereceived image into electrical signals.

The filter 610 and the image sensor 810 may be spaced apart from eachother so as to be opposite to each other in the first direction.

The motion sensor 820 may be mounted on the second holder 800, and maybe conductively connected to the handshake controller 830 through thecircuit pattern formed on the second holder 800.

The motion sensor 820 outputs rotational angular speed informationregarding the movement of the camera module 200. The motion sensor 820may be embodied as a dual-axis or triple-axis gyro sensor or an angularspeed sensor.

The handshake controller 830 may be mounted on the second holder 800,and may be conductively connected to the second position sensor 240 andthe second coil 230 of the lens moving apparatus. For example, thesecond holder 800 may be conductively connected to the circuit board 250of the lens moving apparatus, and the handshake controller 820 mountedon the second holder 800 may be conductively connected to the secondposition sensor 240 and the second coil 230 through the circuit board250.

The handshake controller 830 may output a drive signal, which isrequired to allow the OIS movable unit of the lens moving apparatus toperform handshake compensation, based on feedback signals provided fromthe second position sensor 240 of the lens moving apparatus.

The connector 840 may be conductively connected to the second holder800, and may have a port for the electrical connection of an externalcomponent.

FIG. 20 is an assembled perspective view illustrating a lens movingapparatus 100 according to another embodiment.

The lens moving apparatus illustrated in FIG. 20 may include a movableunit. Here, the movable unit may perform auto-focusing and handshakecompensation. The movable unit may include a bobbin 1110, a first coil1120, a magnet 1130, a housing 1140, an upper elastic member 1150, and alower elastic member 1160.

The bobbin 1110 may be provided on the outer circumferential surfacethereof with the first coil 1120, which is located inside the firstmagnet 1130. The first coil 1120 may be installed in the inner space ofthe housing 140 so as to be reciprocally movable in the first directionvia electromagnetic interaction between the first magnet 1130 and thefirst coil 1120. The first coil 1120 may be installed on the outercircumferential surface of the bobbin 1110 so as to electromagneticallyinteract with the first magnet 1130.

In addition, the bobbin 1110 may be elastically supported by the upperand lower elastic members 1150 and 1160, thereby performingauto-focusing by moving in the first direction.

The bobbin 1110 may include a lens barrel (not shown) in which at leastone lens is installed. The lens barrel may be coupled within the bobbin1110 in various manners.

For example, a female threaded portion may be formed in the innercircumferential surface of the bobbin 1110, and a male threaded portioncorresponding to the female threaded portion may be formed on the outercircumferential surface of the lens barrel. Through screwing, the lensbarrel may be coupled to the bobbin 1110. However, the disclosure is notlimited thereto, and instead of forming the female threaded portion onthe inner circumferential surface of the bobbin 1110, the lens barrelmay be directly fixed inside the bobbin 1110 by other ways excludingscrewing. Alternatively, at least one lens may be integrally formed withthe bobbin 1110 without the lens barrel.

The lens coupled to the lens barrel may be configured as a single sheet,or two or more lenses may configure an optical system.

Auto-focusing may be controlled based on the direction of current, andmay be implemented by moving the bobbin 1110 in the first direction. Forexample, the bobbin 1110 may move upward from the initial positionthereof when forward current is applied, and the bobbin 1110 may movedownward from the initial position thereof when reverse current isapplied. Alternatively, the distance by which the bobbin 1110 moves in apredetermined direction may be increased or reduced by adjusting thequantity of current that flows in one direction.

The bobbin 1110 may be provided on the upper surface and the lowersurface thereof with a plurality of upper support protrusions and lowersupport protrusions. The upper support protrusions may have acylindrical or prismatic shape, and may serve to couple and secure theupper elastic member 1150. The lower support protrusions may have acylindrical or prismatic shape, and may serve to couple and secure thelower elastic member 1160.

The upper elastic member 1150 may have through-holes corresponding tothe upper support protrusions, and the lower elastic member 1160 mayhave through-holes corresponding to the lower support protrusions. Thesupport protrusions and the through-holes may be securely coupled toeach other via thermal fusion or an adhesive such as epoxy.

The housing 1140 may take the form of a hollow column to support thefirst magnet 1130, and may have an approximately square shape. The firstmagnet 1130 and the support member 1220 may be coupled respectively tothe side surface portions of the housing 1140.

In addition, as described above, the bobbin 1110 may be provided withinthe housing 1140 so as to move in the first direction by being guided bythe elastic members 1150 and 1160. In the embodiment, the first magnet1130 may be located on the corner of the housing 1140, and the supportmember 1220 may be disposed on the side surface of the housing 1140.

The upper elastic member 1150 and the lower elastic member 1160 mayelastically support the upward movement and/or downward movement of thebobbin 1110 in the first direction. The upper elastic member 1150 andthe lower elastic member 1160 may be embodied as leaf-springs.

As illustrated in FIG. 20, the upper elastic member 1150 may include twoupper elastic members that are separated from each other. By virtue ofthis bisected configuration, the respective divided parts of the upperelastic member 1150 may receive current of different polarities ordifferent powers. In addition, in a modified embodiment, the lowerelastic member 1160 may be divided into two parts, and the upper elasticmember 1150 may have a unitary configuration.

Meanwhile, the upper elastic member 1150, the lower elastic member 1160,the bobbin 1110, and the housing 1140 may be assembled with one anothervia, for example, thermal fusion and/or using, for example, an adhesive.At this time, for example, after being fixed via thermal bonding, theadhesive may be used to complete the securing process.

The base 1210 may be disposed below the bobbin 1110, and may have anapproximately square shape. A circuit board 1250 may be seated on thebase 1210, and the lower end of the support member 1220 may be securedto the base 1210.

In addition, a support member seating hole may be formed in the uppersurface of the base 1210 so that the lower portion of the support member1220 is fitted into the support member seating hole. An adhesive may beapplied to the support member seating recess 1214 so as to immovablysecure the support member 1220.

The surface of the base 1210 that faces the portion of the circuit board1250 equipped with a terminal rib 1253 may be provided with a supportrecess, which is sized to correspond to the terminal rib 1253. Thesupport recess may be indented to a predetermined depth from the outercircumferential surface of the base 1210, so as to inhibit the portionequipped with the terminal rib 1253 from protruding outward, or so as toadjust the distance by which the portion equipped with the terminal rib1253 protrudes.

The support member 1220 may be disposed on the side surface of thehousing 1140, and may be coupled at the upper end thereof to the housing1140 and at the lower end thereof to the base 1210. The support member1220 may support the bobbin 1110 and the housing 1140 so that the bobbin1110 and the housing 1140 are movable in the second and thirddirections, which are perpendicular to the first direction. In addition,the support member 1220 may be conductively connected to the first coil1120.

The support member 1220 according to the embodiment is located on eachouter side surface of the square housing 1140, and therefore a total offour support members may be symmetrically installed. However, thedisclosure is not limited thereto, and two support members may beprovided on each straight surface, so that a total of eight supportmembers are provided.

In addition, the support member 1220 may be conductively connected tothe upper elastic member 1150, or may be conductively connected to thestraight surface of the upper elastic member 1150.

In addition, since the support member 1220 is formed separately from theupper elastic member 1150, the support member 1220 and the upper elasticmember 1150 may be conductively connected to each other using, forexample, a conductive adhesive or solders. Accordingly, the upperelastic member 1150 may apply current to the first coil 1120 through thesupport member 1220, which is conductively connected thereto.

Although the support member 1220 is illustrated in FIG. 20 as being awire, the disclosure is not limited thereto, and the support member 1220may take a plate shape.

The second coil 1230 may perform handshake compensation by moving thehousing 1140 in the second direction and/or the third direction viaelectromagnetic interaction with the first magnet 1130.

Here, the second direction and the third direction may include not onlythe x-axis and y-axis directions, but also directions that aresubstantially close to the x-axis and y-axis directions. In theembodiment, although the housing 1140 may move parallel to the x-axisand the y-axis in terms of driving, the housing 1140 may also moveslightly obliquely relative to the x-axis or the y-axis when moved whilebeing supported by the support member 1220.

In addition, it is necessary to install the first magnet 1130 at aposition corresponding to the second coil 1230.

The second coil 1230 may be disposed so as to be opposite the firstmagnet 1130 secured to the housing 1140. In one embodiment, the secondcoil 1230 may be disposed outside the first magnet 1130. Alternatively,the second coil 1230 may be spaced apart and downward from the firstmagnet 1130 by a predetermined distance.

According to the embodiment, a total of four second coils 1230 may beinstalled on four corners of a circuit member 1231, without beinglimited thereto. Alternatively, only two second coils, including onesecond-direction second coil and one third-direction second coil, may beinstalled, and four or more second coils may be installed.

In the embodiment, a circuit pattern may be formed in the second coil1230 on the circuit member 1231 and an additional second coil may bedisposed above the circuit member 1231, without being limited thereto.Alternatively, only the second coil 1230 may be disposed above thecircuit member 1231, obviating the circuit pattern having the form ofthe second coil 1230 on the circuit member 1231.

Alternatively, the second coil 1230 may be formed by winding a wire in adonut shape, or may be configured as an FP coil, so as to beconductively connected to the circuit board 1250.

The second coil 1230 may be disposed above the base 1210 and below thehousing 1140. At this time, the circuit member 1231 including the secondcoil 1230 may be installed on the upper surface of the printed circuitboard 1250, which is disposed above the base 1210.

However, the disclosure is not limited thereto, and the second coil 1230may come into close contact with the base 1210, or may be spaced apartfrom the base 1210 by a predetermined distance. The second coil 1230 maybe formed on a separate board, and the board in turn may be stacked onand connected to the printed circuit board 1250.

The printed circuit board 1250 may be coupled to the upper surface ofthe base 1210, and may have a through-hole or recess at a positioncorresponding to the support member seating hole so as to expose thesupport member seating hole.

The circuit board 1250 may have the bent terminal rib 1253 on which aplurality of terminals 1251 is formed. The printed circuit board 1250according to the embodiment may be provided with two bent terminal ribs1253. The terminals 1251 may be arranged on the terminal rib 1253 so asto receive external power and to supply current to the first coil 1120and the second coil 1230. The number of terminals formed on the terminalrib 1253 may be increased or reduced according to the kind of controlelements that are required. In addition, the printed circuit board 1250may have one terminal rib 1253, or may have three or more terminal ribs.

The printed circuit board 1250 may be provided thereon with variouselements, circuit patterns or the like, which are conductively connectedto the terminals. In addition, the printed circuit board 1250 may beprovided thereon with a plurality of layers for forming elements,circuit patterns or the like, which may be conductively connected toeach other.

Elements or circuit patterns may be independently provided on therespective layers, or elements or circuit patterns, which performspecific functions, may be formed by stacking the respective layers.

The terminal rib 1253 is also a portion of the printed circuit board1250. Accordingly, the terminal rib 1253 may be stacked on a pluralityof layers, or may be formed on a single layer.

A cover member 1300 may have an approximately box shape, mayaccommodate, for example, the movable unit, the second coil 1230, and aportion of the printed circuit board 1250, and may be coupled to thebase 1210. The cover member 1300 may inhibit damage to, for example, themovable unit, the second coil 1230, and the printed circuit board 1250accommodated therein. In particular, the cover member 1300 may inhibitthe outward leakage of an electromagnetic field, which is generated by,for example, the first magnet 1130, the first coil 1120, and the secondcoil 1230 accommodated therein, thereby enabling collimation of theelectromagnetic field.

FIG. 21 illustrates a camera module including the lens moving apparatus1000 shown in FIG. 20. FIG. 21 illustrates only the printed circuitboard 1250 and the base 1210. In the drawing, the same reference numbersas those used in FIGS. 19 and 20 indicate the same parts, anddescriptions of the same parts are set forth in a perfunctory manner, orare omitted.

Referring to FIG. 21, the camera module according to the embodiment mayinclude the lens moving apparatus 1000, a first holder 600, an imagesensor 810, a filter 610 and a board 800. The first holder 600 may bedisposed below the base 1210, and may be provided with the filter 610mounted thereon.

The filter 610 may serve to inhibit light having a specific frequencyband having passed through the lens barrel, from being introduced intothe image sensor 810. The filter 610 is preferably placed on the x-yplane.

The filter 610 may be coupled to the upper surface of the first holder600, and may be an infrared-light blocking filter. The area of the firstholder 600 on which the filter 610 is mounted may be formed with a boreso as to allow the light that passes through the filter 610 to beintroduced into the image sensor 810.

The base 1210 and the first holder 600 may be coupled to each other viaan adhesive. The adhesive used herein may include epoxy, thermohardeningadhesive, ultraviolet hardening adhesive and the like.

The board 800 may be disposed below the first holder 600, and may beprovided with the image sensor 810 mounted thereon. The image sensor 810is a component into which the light that passes through the filter 610is introduced and on which an image included in the light is formed.

The image sensor 810 is preferably placed on the x-y plane. In anembodiment, the image sensor 810 may be mounted on the first holder 600.

The board 800 may include various elements, devices, controllers and thelike for converting an image formed on the image sensor 810 into anelectrical signal and transmitting the signals to an external component.

The board 800 may be coupled to the first holder 600. Here, the board800 may be coupled and secured to the first holder 600 using anadhesive, as in the case of the first holder 600. The board 800 may beembodied as a circuit board, on which the image sensor 810 is mounted, acircuit pattern is formed, and various elements are coupled.

The board 800 may be conductively connected to the printed circuit board1250. As a result, the printed circuit board 1250 may receive current,which is required for driving the lens moving apparatus 1000, from theboard 800, and the printed circuit board 1250 and the board 800 mayexchange electric signals with each other.

For example, when the lens moving apparatus 1000 is assembled, theterminals 1251 formed on the printed circuit board 1250 and the solderedportions 820 formed on the board 800 may be disposed at positionscorresponding to each other.

Accordingly, the terminals 1251 of the printed circuit board 1250 andthe soldered portions 820 of the board 800 may be respectively coupledto each other through soldering or the like, so that the printed circuitboard 1250 may be conductively connected to the board 800.

FIG. 22 is a plan view illustrating the printed circuit board 1250according to an embodiment. FIG. 23 is an enlarged view illustratingportion A in FIG. 22. The printed circuit board 1250 may include aterminal rib 1253, the terminals 1251 and a coating layer 1252.

The terminal rib 1253 may be formed at the lateral side of the printedcircuit board 1250 so as to be bendable and to be conductively connectedto an external component. The external component may be, for example,the board 800 of the lens moving apparatus 1000.

As described above, the terminals 1251 formed on the terminal rib 1253and the soldered portions 820 formed on the board 800 may be coupled toeach other through soldering or the like so as to be conductivelyconnected to each other. Consequently, the printed circuit board 1250 ofthe lens moving apparatus 1000 and the board 800 of the camera modulemay be conductively connected to each other.

As illustrated in FIG. 22, the terminal rib 1253 may be embodied as atleast one terminal rib, which protrudes from the printed circuit board1250 in a lateral direction, and may be made of a soft material. To thisend, the printed circuit board 1250, which is integrally formed with theterminal rib 1253, may be entirely made of a soft material.

Accordingly, the terminal rib 1253 may be formed at the lateral side ofthe printed circuit board 1250 in the direction parallel to the printedcircuit board 1250. When the lens moving apparatus is assembled, theterminal rib 1253, made of a soft material, may be bent downward at anangle of about 90°, and may be coupled to a lateral side of the base1210 through bonding or the like.

The terminals 1251 may include a plurality of terminals formed on thesurface of the terminal rib 1253. Specifically, the plurality ofterminals 1251 may be formed on the surface of the terminal rib 1253 atpredetermined intervals through a printing process, an etching processor the like.

The number of terminals 1251 may be appropriately selected depending onthe structures of the printed circuit board 1250, the lens movingapparatus 1000, the board 800 and the like, as well as the electricstructures therebetween. When two terminal ribs 1253 are provided, thereis no necessity for the numbers of terminals 1251 formed on the terminalribs 1253 to coincide with each other.

The coating layer 1252 may be formed on the surfaces of the terminal rib1253 and the terminals 1251 so as to partially cover the surfaces of theterminal rib 1253 and the terminals 1251. The coating layer 1252 may beformed on the surfaces, that is, the upper surface of the terminal rib1253 and the terminals 1251, so as to serve to conductively isolate theterminal rib 1253 and the terminals 1251 from each other, or to protectthem from wear. Here, the coating layer 1252 may be a photo solderresist (PSR) or a coverlay.

Furthermore, the coating layer 1252 may inhibit lead from adhering to anundesired area in a soldering process, and may inhibit various elements,circuit patterns or the like, which are formed on the printed circuitboard 1250, from being directly exposed to the air and thus beingdeteriorated by oxygen or moisture.

The coating layer 1252 may be formed so as to cover the terminals 1251while the surfaces of the terminals 1251 are partially exposed. Sincethe terminals 1251 are intended to be conductively connected to theterminals 1251 of the board 800 or the like, soldered portions forconductive connection are preferably provided. Accordingly, the coatinglayer 1252 may be formed on the upper surfaces of the terminals 1251while exposed regions of the terminals 1251 are left.

The coating layer 1252 may be made of, for example, photo solder resistink or polyimide.

The coating layer 1252 may be formed in such a way as to coat theterminal rib 1253 and the terminals 1251 with photo solder resist inkand to harden the photo solder resist ink. At this time, the exposedregions of the terminals 1251 may be formed by coating the entireterminals 1251 with photo solder resist ink and removing an unnecessaryportion of the photo solder resist ink through light exposure anddeveloping processes. Alternatively, the exposed regions of theterminals 1251 may be formed by applying photo solder resist ink only toa necessary area and hardening the photo solder resist ink.

Polyimide may be prepared in the form of film or tape. The film or tapemay be cut into a desired shape, and may be applied to the surfaces ofthe terminal rib 1253 and the terminals 1251, thereby forming thecoating layer 1252 while the exposed regions are left on the terminals1251.

Alternatively, both photo solder resist ink and polyimide may be used.Depending on an application process and the structure of a product,polyimide may be applied after the application of photo solder resistink, or photo solder resist ink may be applied after the application ofpolyimide.

Polyimide, which is a soft material, may also be used in the productionof a flexible printed circuit board (FPCB). Accordingly, in anembodiment, the printed circuit board 1250 and the coating layer 1252may be made of the same material, that is, polyimide.

Referring to FIG. 23, the region of the terminal 1251 that is indicatedby the hidden line is a region, on the upper surface of which thecoating layer 1252 is formed and which is conductively connected tovarious elements and a circuit pattern provided on the printed circuitboard 1250.

In FIG. 23, the region of the terminal 1251 that is indicated by a solidline is a region, on the upper surface of which the coating layer 1252is not formed so as to be conductively connected to the board 800 or thelike. FIG. 24 also illustrates the terminals 1251 in the same manner asdescribed above.

As illustrated in FIG. 23, a boundary line may be provided between thecoating layer 1252 and the terminal 1251. In an embodiment, the lengthof the boundary line may be set to be longer than the width of theterminal 1251.

If the width of the terminal 1251 is the same as the length of theboundary line L′, cracks are likely to form at the boundary line L′. Inother words, when the camera module including the printed circuit board1250 is subjected to an impact by falling or the like, stress may beconcentrated at the boundary line Ll, and the stress may cause cracks atthe boundary line L′.

In FIGS. 23 and 24, the region of the terminal 1251 that is indicated bythe hidden line above the boundary line L′ may be firmly coupled orsecured to the terminal rib 1253 by means of the coating layer 1252.

However, the region of the terminal 1251 that is indicated by the solidline, that is, the exposed region on which the coating layer 1252 isformed, may be less firmly coupled or secured to the terminal rib 1253compared to the region of the terminal 1251 that is indicated by thehidden line. Since the exposed region may be connected to a componentsuch as the board 800 through soldering, impulsive force, which isapplied to a component such as the board 800 when subjected to anexternal impact, may be directly transmitted to the exposed region.

Accordingly, when the camera module is subjected to an external impactas the result of falling or the like, the exposed region of the terminal1251 may be subjected to a greater impact than the unexposed region thatis indicated by the hidden line, and stress may be concentrated on theboundary line L′ due to the difference in the magnitudes of impact.

Stress concentrated on the boundary line L′ may cause cracks at theterminal 1251. In addition, when stress is accumulated due to therepeated application of external stress, cracks may develop, therebycausing the terminal 1251 to break along the boundary line L′. Thebreakage of the terminal 1251 caused by cracks may cause malfunction ofthe camera module.

In order to inhibit the generation of cracks at the terminal 1251, thelength of the boundary line L, defined between the coating layer 1252formed on the surface of the terminal 1251 and the terminal 1251, may belonger than the width of the terminal 1251.

As illustrated in FIG. 23, the boundary line L may be a line having abent point, that is, it may be the two equilateral sides of an isoscelestriangle. Alternatively, the boundary line L may be the two adjacentsides of a general triangle.

In this configuration, the boundary line L may be longer than the widthof the terminal 1251. Accordingly, stress, which is generated at theterminal 1251 due to the application of an external impact, may be moreextensively dispersed in the extended boundary line L than in the linearboundary line L′.

Since stress is dispersed by virtue of the boundary line L having thisconfiguration, it is possible to inhibit the concentration of stress ona specific point on the boundary line L, that is, to inhibit thegeneration of cracks even when the exposed region of the terminal 1251is subjected to an impact in the longitudinal or lateral direction ofthe terminal 1251 due to the application of an external impact.

FIG. 24 illustrates a printed circuit board 1250-1 according to anotherembodiment. As illustrated in FIG. 24, the boundary line L1 may beconfigured to have a round shape, an arcuate shape or a semicircularshape.

In this case, the boundary line L1 may be longer than the width of theterminal 1251, similar to the case shown in FIG. 23. Accordingly,stress, which is generated at the terminal 1251 due to the applicationof an external impact, may be more extensively dispersed in the extendedboundary line L than in the linear boundary line L′.

Accordingly, by virtue of the dispersion of stress, it is possible tosuppress the concentration of stress on a specific point on the boundaryline L1, that is, the inhibit the generation of cracks due to theapplication of an external impact, similar to the case shown in FIG. 23.

In addition, in the case in which the boundary line L1 is configured tohave a round shape, since a notch or a sharp edge is not formed on theboundary line L1, it is possible to inhibit the generation of cracks dueto the concentration of stress on the notch or the sharp edge.

Although not illustrated in the drawings, the boundary line L1 may beconfigured to have any shape, such as a corrugated shape, a shape havingrepeated bent points or a shape having repeated curves as long as thelength of the boundary line L1 is increased.

In FIGS. 23 and 24, the width D or D1 of the boundary line L or L1,which is measured in the longitudinal direction of the terminal 1251,may be appropriately adjusted such that stress is not concentrated on aspecific point on the boundary line L or L1.

For example, the width of the boundary line L or L1 may be within arange of 0.02 mm to 0.08 mm, and preferably a range of 0.03 mm to 0.07mm.

If the width D or D1 of the boundary line L or Ll is less than 0.02 mm,it is not possible to obtain an effect of substantially suppressing thegeneration of cracks compared to the linear boundary line L′. If thewidth D or D1 of the boundary line L or L1 greater than 0.08 mm,portions similar to notches or sharp edges are formed, and thus stressis concentrated on the portions, thereby causing cracks.

FIG. 25 illustrates a printed circuit board 1250-2 according to afurther embodiment. FIG. 26 is a side view of the printed circuit boardshown in FIG. 25 when viewed in the direction of B. In FIG. 25, thecoating layer 1252, which is formed at the uppermost layer of theprinted circuit board 1250-2, is indicated by a hidden line. The drawingis conveniently drawn so as to clearly illustrate the structures of aterminal 1251 and a conductive layer 1254, which are formed under thehidden line. This is equally applied to FIG. 27, which will be describedlater.

As illustrated in FIGS. 25 and 26, the printed circuit board 1250-2 mayinclude the conductive layer 1254, which is formed on the lower surfaceof the terminal 1251 so as to be conductively connected to the terminal1251.

The conductive layer 1254 may be formed into a plate shape from copperor a copper alloy, and may include the same number of conductive layersas the number of terminals 1251. One terminal 1251 and one conductivelayer 1254, which correspond to each other, may be isolated from anotherterminal 1251 and another conductive layer 1254, and may be conductivelyconnected to each other.

Although FIG. 25 exemplarily illustrates the case in which the boundaryline L has a bent point, the conductive layer 1254 may be provided evenif the boundary line L has any of a round shape, an arcuate shape and acorrugated shape.

The conductive layer 1254 may be conductively connected to the terminal1251. To this end, the conductive layer 1254 and the terminal 1251 maybe conductively connected to each other through, for example, a printingprocess. Alternatively, the conductive layer 1254 and the terminal 1251may be attached to each other via a conductive adhesive.

The layered structure of the terminal 1253 of the printed circuit board1250-2 may be configured as illustrated in FIG. 26. In this layeredstructure, the terminal rib 1253, the conductive layer 1254, theterminal 1251 and the coating layer 1252 may be formed in that orderbased on the center of the terminal 1251.

Specifically, the terminal rib 1253 may be disposed at the lowermostlayer, and the conductive layer 1254 may be disposed on the uppersurface of the terminal rib 1253. The terminal 1251 may be disposed onthe upper surface of the conductive layer 1254. A portion of the coatinglayer 1252 may be disposed on the upper surface of the terminal rib 1253such that the upper surface of the terminal rib 1253 is partiallyexposed.

The exposed area of the upper surface of the terminal rib 1253 may beconductively connected to a component such as the board 800. Here, theterminal rib 1253, the conductive layer 1254 and the terminal 1251 maybe conductively connected to each other, so that various elements and acircuit pattern formed on the printed circuit board 1250-2 or theterminal rib 1253 and the terminal 1251 may be conductively connected toeach other.

Even if cracks form at the boundary plane between the terminal 1251 andthe coating layer 1252, thereby causing breakage of the terminal 1251,it is still possible to maintain the conductive connection between theterminal 1251 and the terminal rib 1253 by means of the conductive layer1254. Accordingly, the conductive layer 1254 is able to inhibit breakageof the terminal 1251 at the boundary line L of the terminal 1251.

FIG. 27 illustrates a printed circuit board 1250-3 according to still afurther embodiment. As illustrated in FIG. 27, the printed circuit board1250-3 may further include at least one via 1255. The via 1255 may beformed through the conductive layer 1254 and the terminal 1251 so as toconductively connect the conductive layer 1254 to the terminal 1251.

The via 1255 may be formed by plating a conductive metal such as copperor nickel, and the plated metal may conductively connect the terminal1251 to the conductive layer 1254, disposed on the upper surface of theterminal 1251.

The via 1255 may be formed in each of the terminals 1251 and each of theconductive layers 1254, and one terminal 1251 and one conductive layer1254, which correspond to each other, may be appropriately provided withone or more vias 1255 in consideration of the overall size and structureof the printed circuit board 1250-3, the size of the via 1255 and thelike.

The layered structure of the printed circuit board 1250-3 may beconfigured such that the terminal rib 1253, the conductive layer 1254,the terminal 1251 and the coating layer 1252 are layered in this order,based on the center of the terminal 1251 and the via 1255 may be formedtherein.

Specifically, the terminal rib 1253 may be disposed at the lowermostlayer, and the conductive layer 1254 may be disposed on the uppersurface of the terminal rib 1253. The terminal 1251 may be disposed onthe upper surface of the conductive layer 1254. A portion of the coatinglayer 1252 may be disposed on the upper surface of the terminal rib 1253such that the upper surface of the terminal rib 1253 is partiallyexposed.

The via 1255 may penetrate through the conductive layer 1254 and theterminal 1251, and the via 1255 may conductively connect the terminalrib 1253, the conductive layer 1254 and the terminal 1251 to each other.

By virtue of the via 1255, the terminal rib 1253, the conductive layer1254 and the terminal 1251 may be conductively connected to each other,and various elements and the circuit pattern, which are provided on theprinted circuit board 1250 or the terminal rib 1253, may be conductivelyconnected to the terminal 1251.

Even if cracks form in the boundary plane between the terminal 1251 andthe coating layer 1252, thereby causing breakage of the terminal 1251,it is still possible to maintain the conductive connection between theterminal 1251 and the terminal rib 1253 and the conductive layer 1254 bymeans of the via 1255. Accordingly, the via 1255 is able to inhibitbreakage of the terminal 1251 at the boundary line L of the terminal1251.

The embodiment is constructed such that the length of the boundary lineL between the coating layer 1252 and the terminal 1251 is increased soas to widely disperse stress generated at the boundary line L, therebysuppressing the generation of cracks due to the concentration of stress.

In addition, since the printed circuit board 1250-3 includes theconductive layer 1254, there is an effect of maintaining the conductiveconnection between the printed circuit board 1250 and the terminal 1251even if the terminal 1251 is broken due to stress generated at theboundary line L.

Furthermore, since the printed circuit board 1250-3 includes the via1255, there is an effect of maintaining the conductive connectionbetween the printed circuit board 1250-3 and the terminal 1251 even ifthe terminal 1251 is broken due to stress generated at the boundary lineL.

The printed circuit boards 1250 and 1250-1 to 1250-3 according to theabove embodiments may be equally applied to the circuit board 250 of thelens moving apparatus illustrated in FIG. 2.

FIG. 28 is a perspective view illustrating a portable terminal 200Aincluding a camera module according to an embodiment. FIG. 29 is a viewillustrating the configuration of the portable terminal 200A illustratedin FIG. 28.

Referring to FIGS. 28 and 29, the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an audio/video (A/V) input unit 720, a sensingunit 740, an input/output unit 750, a memory unit 760, an interface unit770, a controller 780, and a power supply unit 790.

The body 850 illustrated in FIG. 28 has a bar shape, without beinglimited thereto, and may be any of various types such as, for example, aslide type, a folder type, a swing type, or a swivel type, in which twoor more sub-bodies are coupled so as to be movable relative to eachother.

The body 850 may include a case (e.g. casing, housing, or cover)defining the external appearance of the terminal. For example, the body850 may be divided into a front case 851 and a rear case 852. A varietyof electronic components of the terminal may be mounted in the spacedefined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast receiving module 711, amobile communication module 712, a wireless Internet module 713, a nearfield communication module 714, and a location information module 715.

The A/V input unit 720 serves to input audio signals or video signals,and may include, for example, a camera 721 and a microphone 722.

The camera 721 may be the camera module 200 according to the embodimentillustrated in FIG. 19 or the camera module illustrated in FIG. 21.

The sensing unit 740 may sense the current state of the terminal 200A,such as, for example, the opening or closing of the terminal 200A, thelocation of the terminal 200A, the presence of a user's touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. For example, when the terminal 200A is aslide-type phone, the sensing unit 740 may detect whether the slide-typephone is open or closed. In addition, the sensing unit 740 serves tosense, for example, whether power is supplied from the power supply unit790, or whether the interface unit 770 is coupled to an externalcomponent.

The input/output unit 750 serves to generate, for example, visual,audible, or tactile input or output. The input/output unit 750 maygenerate input data to control the operation of the terminal 200A, andmay display information processed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touchscreen panel 753. Thekeypad unit 730 may generate input data in response to input to akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich varies in response to electrical signals. For example, the displaymodule 751 may include at least one of a liquid crystal display, a thinfilm transistor liquid crystal display, an organic light emitting diodedisplay, a flexible display and a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in, for example, a call signal receivingmode, a call mode, a recording mode, a voice recognition mode, or abroadcast receiving mode, or may output audio data stored in the memoryunit 760.

The touchscreen panel 753 may convert variation in capacitance, causedby a user's touch on a specific region of a touchscreen, into electricalinput signals.

The memory unit 760 may store programs for the processing and control ofthe controller 780, and may temporarily store input/output data (e.g. aphone book, messages, audio, still images, pictures, and moving images).For example, the memory unit 760 may store images captured by the camera721, for example, pictures or moving images.

The interface unit 770 serves as a passage for connection between theterminal 200A and an external component. The interface unit 770 mayreceive power or data from the external component, and may transmit thesame to respective constituent elements inside the terminal 200A, or maytransmit data inside the terminal 200A to the external component. Forexample, the interface unit 770 may include, for example, awired/wireless headset port, an external charger port, a wired/wirelessdata port, a memory card port, a port for the connection of a devicehaving an identification module, an audio input/output (I/O) port, avideo I/O port, and an earphone port.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to, for example, voice calls, data communication, and videocalls.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be provided inside thecontroller 780, or may be provided separately from the controller 780.

The controller 780 may perform pattern recognition processing, by whichwriting or drawing, input to a touchscreen is perceived as charactersand images respectively.

The power supply unit 790 may supply power required to operate therespective constituent elements upon receiving external power orinternal power under the control of the controller 780.

As is apparent from the above description, the embodiments are able toimprove the reliability of operation of auto-focusing by inhibitingeffects of deviation in the intensity of a magnetic field of the magnetowing to variation in temperature, and are able to automaticallycompensate for variation in the focal length of the lens caused byvariation in temperature.

In addition, the embodiments are able to suppress the generation ofcracks in the printed circuit board due to the concentration of stress,and are able to maintain the conductive connection between the printedcircuit board and the terminal even if the terminal of the printedcircuit board is breaks due to the concentration of stress.

The features, configurations, effects and the like described above inthe embodiments are included in at least one embodiment, and but are notnecessary to be limited to only one embodiment. In addition, thefeatures, configuration, effects and the like exemplified in therespective embodiments may be combined with other embodiments ormodified by those skilled in the art. Accordingly, content related tothese combinations and modifications should be construed as fallingwithin the scope of the embodiments.

1. A lens moving apparatus comprising: a base; a housing disposed on thebase; a bobbin disposed in the housing and configured to move in a firstdirection; and a circuit board disposed on the base; wherein the circuitboard comprises a terminal rib, a plurality of terminals disposed on theterminal rib, and a coating layer disposed on an upper surface of theterminal rib and upper surfaces of the plurality of terminals; whereinthe coating layer exposes a portion of the upper surface of each of theplurality of terminals, wherein at least a portion of the coating layeris disposed between the plurality of terminals, and wherein the at leasta portion of the coating layer extends to one end of the terminal rib onwhich one end of each of the plurality of terminals is disposed.
 2. Thelens moving apparatus according to claim 1, wherein a first boundaryline is formed between the coating layer and the upper surface of eachof the plurality of terminals, and a length of the first boundary lineis longer than a width of each of the plurality of terminals.
 3. Thelens moving apparatus according to claim 2, wherein a second boundaryline is formed between the coating layer and a region of the terminalrib positioned between the plurality of terminals, and the secondboundary line extends to the one end of the terminal rib.
 4. The lensmoving apparatus according to claim 2, wherein the first boundary lineis formed in at least one of a linear shape having a bending point, atriangular shape, a round shape, an arc shape, and a semicircular shape.5. The lens moving apparatus according to claim 1, wherein the coatinglayer is made of photo solder resist ink or polyimide.
 6. The lensmoving apparatus according to claim 1, wherein the circuit boardcomprises a conductive layer disposed between the terminal rib and lowersurfaces of the plurality of terminals, and wherein the terminal rib,the conductive layer, and the plurality of terminals are electricallyconnected to each other.
 7. The lens moving apparatus according to claim1, comprising: a first coil disposed on the bobbin; a magnet disposed onthe housing and facing the first coil; an elastic member coupled to thebobbin and the housing; and a second coil facing the magnet andelectrically connected to the circuit board.
 8. The lens movingapparatus according to claim 7, wherein the second coil comprises: acircuit member disposed on the circuit board; and a coil formed in thecircuit member and facing the magnet.
 9. The lens moving apparatusaccording to claim 1, comprising a base disposed under the bobbin,wherein the circuit board is disposed on an upper surface of the base,and wherein the terminal rib is bent on an upper surface of the circuitboard.
 10. The lens moving apparatus according to claim 6, whereincircuit board comprises a via electrically connecting the terminal rib,the conductive layer, and the plurality of terminals.
 11. A lens movingapparatus comprising: a housing; a bobbin disposed in the housing; afirst coil and a magnet for moving the bobbin by interaction betweeneach other; and a circuit board electrically connected to the firstcoil, wherein the circuit board comprises a terminal rib, a plurality ofterminals disposed on the terminal rib, and a coating layer disposed onthe terminal rib and upper surfaces of the plurality of terminals,wherein each of the plurality of terminals comprises a first exposedarea exposed from the coating layer, and a length of a first boundaryline between the first exposed area and the coating layer is longer thana width of each of the plurality of terminals, wherein the coating layercomprises a first portion disposed on a portion of the terminal ribpositioned between the plurality of terminals, and wherein the firstportion of the coating layer extends to one end of the terminal rib onwhich one end of each of the plurality of terminals is disposed.
 12. Thelens moving apparatus according to claim 11, wherein the circuit boardcomprises a conductive layer disposed on the terminal rib, wherein theplurality of terminals are disposed on an upper surface of theconductive layer, wherein each of the plurality of terminals exposes aportion of the upper surface of the conductive layer.
 13. The lensmoving apparatus according to claim 12, wherein the terminal rib, theconductive layer, and the plurality of terminals are electricallyconnected to each other.
 14. A lens moving apparatus comprising: a base;a housing disposed on the base; a bobbin disposed in the housing; afirst coil and a magnet for moving the bobbin by interaction betweeneach other; a second coil facing the magnet and moving the housingthrough interaction with the magnet; and a circuit board electricallyconnected to the second coil, wherein the circuit board comprises: anupper surface disposed on an upper surface of the base; a terminal ribbent from the upper surface thereof; a plurality of terminals disposedon the terminal rib; and a coating layer disposed on an upper surface ofthe terminal rib and upper surfaces of the plurality of terminals,wherein the coating layer exposes at least a portion of an upper surfaceof each of the plurality of terminals, wherein the coating layercomprises: a first region disposed on the portion of the upper surfaceof each of the plurality of terminals; and a second region disposed onthe terminal rib between the plurality of terminals, wherein a firstboundary line is formed between the first region of the coating layerand upper surfaces of the plurality of terminals, and the first boundaryline comprises a first line, a second line, and a vertex where the firstline and the second line meet, wherein the second region of the coatinglayer extends to one end of the terminal rib on which one end of each ofthe plurality of terminals is disposed.
 15. The lens moving apparatusaccording to claim 14, wherein the vertex is closer to an other end ofthe terminal rib than to the one end of the terminal rib, and whereinthe other end of the terminal rib is a portion where the upper surfaceof the circuit board and the terminal rib meet, and the one end of theterminal rib is located opposite the other end of the terminal rib. 16.The lens moving apparatus according to claim 14, wherein a portion ofthe terminal rib positioned between the plurality of terminals and thesecond region of the coating layer is exposed from the coating layer.17. The lens moving apparatus according to claim 14, wherein a secondboundary line is formed between the second region of the coating layerand the terminal rib, and the second boundary line extends to the oneend of the terminal rib.
 18. The lens moving apparatus according toclaim 14, wherein an upper surface of each of the plurality of terminalscomprises a first side and a second side opposite the first side, andwherein each of the first side and the second side is parallel to adirection from the one end of the terminal rib to an other end of theterminal rib.
 19. The lens moving apparatus according to claim 14,comprising: an elastic member coupled to the bobbin and the housing; anda support member electrically connected to the elastic member.
 20. Alens moving apparatus comprising: a base; a housing disposed on thebase; a bobbin disposed in the housing and configured to move in a firstdirection; and a circuit board disposed on the base and comprising aterminal rib, a plurality of terminals disposed on the terminal rib, anda coating layer disposed on an upper surface of the terminal rib andupper surfaces of the plurality of terminals.